公开(公告)号：US20060211232A1

公开(公告)日：2006-09-21

申请号：US10907005

申请日：2005-03-16

申请人： Mei-Jen Liu ,  Yu-Ting Lai ,  Kuang-Shin Lee ,  Ming-Tsung Tung

发明人： Mei-Jen Liu ,  Yu-Ting Lai ,  Kuang-Shin Lee ,  Ming-Tsung Tung

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/00014

摘要： A method for manufacturing gold bumps includes providing a substrate including a patterned protective layer, which exposes at least a bonding pad, on a surface, covering a photo resist on the surface of the substrate, performing a photolithography process to pattern the photo resist for exposing a portion of the protective layer and the bonding pad, removing a portion of the protective layer, removing the photo resist, and performing a gold bumping process. The resulting thickness of the protective layer covering the bonding pad is smaller than the resulting thickness of the protective layer covering the substrate.

摘要翻译： 一种用于制造金凸块的方法包括：提供包括图案化保护层的基板，该图案保护层在表面上至少露出焊盘，覆盖基板表面上的光致抗蚀剂，执行光刻工艺以对曝光的光致抗蚀剂进行图案化 保护层和接合焊盘的一部分，去除保护层的一部分，去除光致抗蚀剂，并执行金碰撞处理。 覆盖接合焊盘的保护层的所得厚度小于覆盖衬底的保护层的所得厚度。