公开(公告)号：US11927606B2

公开(公告)日：2024-03-12

申请号：US18071304

申请日：2022-11-29

Applicant: Melexis Technologies SA

Inventor： Lucian Barbut ,  Francis Monchal ,  Simon Houis ,  Lionel Tombez

IPC: G01R15/20 ,  G01R19/32

CPC classification number: G01R15/202 ,  G01R15/205 ,  G01R19/32

Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.

公开(公告)号：US11531046B2

公开(公告)日：2022-12-20

申请号：US17484011

申请日：2021-09-24

Applicant: Melexis Technologies SA

Inventor： Lucian Barbut ,  Francis Monchal ,  Simon Houis ,  Lionel Tombez

IPC: G01R15/20 ,  G01R19/32

Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.