公开(公告)号：US20230393002A1

公开(公告)日：2023-12-07

申请号：US18328093

申请日：2023-06-02

Applicant: Melexis Technologies SA

Inventor： Theo LE SIGNOR ,  Gael CLOSE ,  Nicolas DUPRE

IPC: G01L5/00 ,  G01L1/12 ,  G01L1/24 ,  B25J13/08 ,  B25J9/16

CPC classification number: G01L5/0061 ,  G01L1/122 ,  G01L1/24 ,  B25J13/085 ,  B25J9/1612 ,  B25J15/08

Abstract: A soft sensor arrangement for measuring a force includes a sensor, a deformable element deformable by the force, and an element for reacting with the sensor for measuring the force by a deformation of the deformable element. The deformable element extends at least partially between the sensor and the element.

公开(公告)号：US20240094071A1

公开(公告)日：2024-03-21

申请号：US18466974

申请日：2023-09-14

Applicant: Melexis Technologies SA

Inventor： Jeroen DIDDEN ,  Theo LE SIGNOR ,  Gael CLOSE ,  Nicolas DUPRE

IPC: G01L1/12

CPC classification number: G01L1/122

Abstract: A method of manufacture of a force sensor and a force sensor is provided. The force sensor can be used to measure contact forces. The force sensor includes a substrate with an electromagnetic sensing element for contactless sensing of a field formed by a target. The target is included in a flexible piece which receives the force, and can deform by it. The flexible piece is treated so that the force sensor is reliable and has long durability.

公开(公告)号：US20220412816A1

公开(公告)日：2022-12-29

申请号：US17850566

申请日：2022-06-27

Applicant: Melexis Technologies SA

Inventor： Nicolas DUPRE ,  Gael CLOSE ,  Theo LE SIGNOR ,  Tim VANGERVEN

IPC: G01L1/12 ,  G01R33/07

Abstract: A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.

公开(公告)号：US20220412791A1

公开(公告)日：2022-12-29

申请号：US17850509

申请日：2022-06-27

Applicant: Melexis Technologies SA

Inventor： Gael CLOSE ,  Jerome DEGOIS ,  Nicolas DUPRE ,  Theo LE SIGNOR ,  Tim VANGERVEN

IPC: G01G7/02 ,  G01L1/04 ,  G01R33/07 ,  G01R33/00 ,  G01L1/12

Abstract: A weight sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece by a product due to the weight of said product, the displacement of the target piece with respect to sensing elements can be sensed.