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1.发明申请公开(公告)号：US20220377907A1
公开(公告)日：2022-11-24
申请号：US17305233
申请日：2021-07-01
发明人： Elad MENTOVICH , Boaz ATIAS , Doron NAVEH , Eilam Zigi Ben SMOLINSKY , Adi LEVI
IPC分类号： H05K3/22 , H05K1/02 , C01B32/188
摘要： Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.
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公开(公告)号：US20220377912A1
公开(公告)日：2022-11-24
申请号：US17305205
申请日：2021-07-01
发明人： Boaz ATIAS , Elad MENTOVICH , Yaniv ROTEM , Doron NAVEH , Adi LEVI , Yosi BEN-NAIM , Yaad ELIYA , Shlomo DANINO , Eran LIPP
IPC分类号： H05K3/46 , H05K3/38 , C01B32/184
摘要： Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.
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