公开(公告)号：US20230413417A1

公开(公告)日：2023-12-21

申请号：US17844275

申请日：2022-06-20

Applicant: Mellanox Technologies Ltd.

Inventor： Igor LOIFERMAN ,  Tomer KLEIN ,  Rom BECKER

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0203 ,  H05K2201/10015 ,  H05K3/303 ,  H05K1/181

Abstract: A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.