公开(公告)号：US12171056B2

公开(公告)日：2024-12-17

申请号：US17844275

申请日：2022-06-20

Applicant: Mellanox Technologies Ltd.

Inventor： Igor Loiferman ,  Tomer Klein ,  Rom Becker

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30

Abstract: A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.

公开(公告)号：US11923629B2

公开(公告)日：2024-03-05

申请号：US17548688

申请日：2021-12-13

Applicant: Mellanox Technologies Ltd.

Inventor： Tamir Lederman ,  Aziz Mazbar ,  Tomer Klein ,  Alexander Shusterman ,  Andrey Ger

IPC: H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7052 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A device may include a frame, a first leg extending from the frame, and a second leg extending from the frame, wherein each of the first leg and the second leg is curved in a respective direction, the respective directions being different.