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Patent Agency Ranking
公开(公告)号：US12171056B2
公开(公告)日：2024-12-17
申请号：US17844275
申请日：2022-06-20
Applicant: Mellanox Technologies Ltd.
Inventor： Igor Loiferman , Tomer Klein , Rom Becker
Abstract: A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.
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公开(公告)号：US12284783B2
公开(公告)日：2025-04-22
申请号：US17534645
申请日：2021-11-24
Applicant: Mellanox Technologies Ltd.
Inventor： Oren Weltsch , Rom Becker , Shay Zaretsky , Ayal Shabtay , Beeri Halachmi , Yuval Blayer , Kfir Katz , Yuval Dagan , Bar Noyman
Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.
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公开(公告)号：US20240090165A1
公开(公告)日：2024-03-14
申请号：US17944638
申请日：2022-09-14
Applicant: Mellanox Technologies Ltd.
Inventor： Oren Weltsch , Igal Gutman , Rom Becker , Shay Zaretsky , Ayal Shabtay , Michal Shlomai Hermon , Kfir Katz
CPC classification number: H05K7/20254 , H04Q1/035 , H05K7/20272 , H05K7/2049
Abstract: An electronic device may include a receptacle cage comprising a longitudinal aperture extending along a portion of a top surface of the receptacle cage, a cooling body disposed directly on the top surface of the receptacle cage, wherein a longitudinal portion of a bottom surface of the cooling body is disposed within the longitudinal aperture on the top surface of the receptacle cage, a first conduit to deliver a liquid coolant into an interior of the cooling body, and a second conduit to deliver the liquid coolant from the interior of the cooling body.
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公开(公告)号：US20230164948A1
公开(公告)日：2023-05-25
申请号：US17534645
申请日：2021-11-24
Applicant: Mellanox Technologies Ltd.
Inventor： Oren WELTSCH , Rom Becker , Shay Zaretsky , Ayal Shabtay , Beeri Halachmi , Yuval Blayer , Kfir Katz , Yuval Dagan , Bar NOYMAN
CPC classification number: H05K7/20272 , H05K7/20263 , G06F1/20 , G06F2200/201 , H05K7/20781
Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.
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公开(公告)号：US20230137375A1
公开(公告)日：2023-05-04
申请号：US17517007
申请日：2021-11-02
Applicant: Mellanox Technologies Ltd.
Inventor： Ayal SHABTAY , Alon Rokach , Bar Noyman , Jamal Mousa , Nimer Hazin , Rom Becker
Abstract: A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.
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