公开(公告)号：US11818474B1

公开(公告)日：2023-11-14

申请号：US17895875

申请日：2022-08-25

Applicant: Meta Platforms Technologies, LLC

Inventor： Alex Locher ,  Naveen Makineni ,  Oskar Linde ,  John Enders Robertson ,  Anthony Aslan Tenggoro

IPC: H04N25/133 ,  H04N23/84 ,  H04N25/13 ,  G06T3/40 ,  G06T19/00 ,  H04N13/388

CPC classification number: H04N25/133 ,  G06T3/4015 ,  H04N23/843 ,  H04N25/134 ,  G06T19/006 ,  H04N13/388

Abstract: In one embodiment, a computing system may receive sensor data from an image sensor having a pixel array including color pixel sensors and panchromatic pixel sensors in a first pattern. Each of the color pixel sensors is associated with one of several color channels. The computing system may generate, based on the sensor data, a filtered monochrome image including monochrome values corresponding to the pixel array of the image sensor. The computing system may generate a filtered color image having a second pattern of color channels. A first pixel of a particular color channel at a first pixel location in the filtered color image is determined based on the monochrome value corresponding to the first pixel location in the filtered monochrome image, the sensor data measured by a color pixel sensor at a second pixel location, and the monochrome value at the second pixel location in the filtered monochrome image.

公开(公告)号：US20250126341A1

公开(公告)日：2025-04-17

申请号：US18886915

申请日：2024-09-16

Applicant: Meta Platforms Technologies, LLC

Inventor： Guangxun Liao ,  Kevin Kha ,  Andrew Matthew Bardagjy ,  Minhua Liang ,  Cina Hazegh ,  Linsen Bie ,  Yizhi Xiong ,  Anthony Aslan Tenggoro

IPC: H04N23/55 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54

Abstract: A camera includes an image sensor package, a lens assembly, and an adhesive or dam compound. The image sensor package includes an image pixel array and support circuitry disposed around the image pixel array. The lens assembly includes a lens barrel disposed around lens elements configured to focus image light to the image pixel array. The adhesive or dam compound adheres the lens barrel to the support circuitry in an inactive area of the image sensor package.