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公开(公告)号:US20240295690A1
公开(公告)日:2024-09-05
申请号:US18441693
申请日:2024-02-14
发明人: Dusan COSO , Steven Alexander-Boyd Hickman , Giuseppe Calafiore , Petr Markov , Shermin Arab , John Michael Goward , Rahul Agarwal , Zhujun Shi
IPC分类号: G02B6/12
CPC分类号: G02B6/12 , G02B2006/12121
摘要: According to examples, an apparatus for implementing a hermetically-covered photonic integrated circuit on a substrate having an integrated laser diode is described. The apparatus may include a cover wafer, a housing layer including a waveguide, the waveguide including a photonic integrated circuit, a laser die including a laser cavity, and a base substrate. The base substrate may include an emission window to provide a reflective design and to eliminate a need for a polarized beam splitter, a through-wafer via element to electrical coupling to the laser die and one or more pillars to set a height of the laser die relative to the photonic integrated circuit.