-
公开(公告)号:US20240093984A1
公开(公告)日:2024-03-21
申请号:US18088302
申请日:2022-12-23
Applicant: Meta Platforms Technologies, LLC
Inventor: Guohua Wei , Petr Markov , Qing Chao
CPC classification number: G01B11/2513 , G02B6/12004 , G02B27/0093 , G02B27/017 , G06V40/18 , H01S5/18305 , H01S5/4031 , G02B2006/12038 , G02B2006/1204 , G02B2006/12061 , G02B2027/0178 , G06V2201/12
Abstract: An optical system is configured to support eye tracking operations in a head mounted device. The optical system includes a transparent layer, a laser, and first and second output couplers. The laser is configured to emit light into the transparent layer. The first output coupler is configured to out-couple a first portion of the light from a first location of the transparent layer. The second output coupler is configured to out-couple a second portion of the light from a second location of the transparent layer. The first and second output couplers are in the field-of-view of a user. A combination of the first portion of the light and the second portion of the light out-coupled from the first output coupler and the second output coupler is configured to generate a fringe pattern, for example, on an eye of a user of the head mounted device.
-
2.
公开(公告)号:US20240295690A1
公开(公告)日:2024-09-05
申请号:US18441693
申请日:2024-02-14
Applicant: Meta Platforms Technologies, LLC
Inventor: Dusan COSO , Steven Alexander-Boyd Hickman , Giuseppe Calafiore , Petr Markov , Shermin Arab , John Michael Goward , Rahul Agarwal , Zhujun Shi
IPC: G02B6/12
CPC classification number: G02B6/12 , G02B2006/12121
Abstract: According to examples, an apparatus for implementing a hermetically-covered photonic integrated circuit on a substrate having an integrated laser diode is described. The apparatus may include a cover wafer, a housing layer including a waveguide, the waveguide including a photonic integrated circuit, a laser die including a laser cavity, and a base substrate. The base substrate may include an emission window to provide a reflective design and to eliminate a need for a polarized beam splitter, a through-wafer via element to electrical coupling to the laser die and one or more pillars to set a height of the laser die relative to the photonic integrated circuit.
-