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公开(公告)号：US06648979B2
公开(公告)日：2003-11-18
申请号：US09768833
申请日：2001-01-24
IPC分类号： B08B700
CPC分类号： H01L21/67046 , B08B1/04
摘要： A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.
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2.发明授权公开(公告)号：US06186864B1
公开(公告)日：2001-02-13
申请号：US09391130
申请日：1999-09-07
IPC分类号： B24B4900
CPC分类号： B24B49/183 , B24B37/005
摘要： In a chemical-mechanical polishing (CMP) process, semiconductor substrates are rotated against a polishing pad in order to planarize substrate layers. The condition of the polishing pad directly affects the polishing rate of material removal and uniformity of removal from the semiconductor wafer. Conditioning of the polishing pad surface with an abrasive improves polishing uniformity and rates, however, it has the detrimental affect of removing a quantity of pad material. A method and apparatus for monitoring polishing pad wear during processing is developed to extend the pad's useful life, and maintain pad uniformity. This is accomplished in the present invention by measuring and monitoring the diminished pad thickness using a non-intrusive measurement system, and creating a closed-loop system for adjusting the chemical-mechanical polishing tool process parameters. The non-intrusive measurement system consists of an interferometer measurement technique utilizing ultrasound or electromagnetic radiation transmitters and receivers aligned to cover any portion of the radial length of a polishing pad surface. The measurement system is sensitive to relative changes in pad thickness for uniformity, and to abrupt changes such as detecting wafer detachment from the CMP wafer carrier.
摘要翻译： 在化学机械抛光（CMP）工艺中，半导体衬底相对于抛光垫旋转以平坦化衬底层。 抛光垫的状态直接影响材料去除的抛光速率和从半导体晶片去除的均匀性。 用研磨剂调理抛光垫表面可以提高抛光均匀性和速率，但是对去除一定量的垫材料有不利影响。 开发了用于在处理期间监测抛光垫磨损的方法和装置，以延长垫的使用寿命并保持垫的均匀性。 这在本发明中通过使用非侵入式测量系统测量和监测减小的垫厚度并创建用于调节化学机械抛光工具工艺参数的闭环系统来实现。 非侵入式测量系统由干涉仪测量技术组成，其利用超声波或电磁辐射发射器和接收器对准以覆盖抛光垫表面的径向长度的任何部分。 测量系统对于均匀性的焊盘厚度的相对变化以及诸如检测从CMP晶片载体的晶片脱离的突然变化敏感。
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3.发明授权
公开(公告)号：US6045434A
公开(公告)日：2000-04-04
申请号：US969148
申请日：1997-11-10
IPC分类号： B24B37/005 , B24B49/00
CPC分类号： B24B49/183 , B24B37/005
摘要： A method and apparatus for monitoring polishing pad wear during processing is developed to extend the pad's useful life, and maintain pad uniformity. This is accomplished in the present invention by measuring and monitoring the diminished pad thickness using a non-intrusive measurement system, and creating a closed-loop system for adjusting the chemical-mechanical polishing tool process parameters. The non-intrusive measurement system consists of an interferometer measurement technique utilizing ultrasound or electromagnetic radiation transmitters and receivers aligned to cover any portion of the radial length of a polishing pad surface. The measurement system is sensitive to relative changes in pad thickness for uniformity, and to abrupt changes such as detecting wafer detachment from the CMP wafer carrier.
摘要翻译： 开发了用于在处理期间监测抛光垫磨损的方法和装置，以延长垫的使用寿命并保持垫的均匀性。 这在本发明中通过使用非侵入式测量系统测量和监测减小的垫厚度并创建用于调整化学机械抛光工具工艺参数的闭环系统来实现。 非侵入式测量系统由干涉仪测量技术组成，其利用超声波或电磁辐射发射器和接收器对准以覆盖抛光垫表面的径向长度的任何部分。 测量系统对于均匀性的焊盘厚度的相对变化以及诸如检测从CMP晶片载体的晶片脱离的突然变化敏感。
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公开(公告)号：US5813082A
公开(公告)日：1998-09-29
申请号：US686048
申请日：1996-07-24
CPC分类号： H01L21/67046 , B08B1/02 , H01L21/67028
摘要： A cleaning pad and roller assembly for cleaning semiconductor wafers. The pad may be a felt sheet with a pair of tabs located at opposite ends. The roller may be polyvinylchloride and may have a drive gear at one end and a clamp at each end. Each clamp is a clamping lever mounted on a shelf and may be locked in place by a clamping screw. Each clamping lever may have a pivot at one end and a serrated surface at an opposite end. The clamping screw may pass through the clamping lever into the shelf.
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