公开(公告)号：US12131918B2

公开(公告)日：2024-10-29

申请号：US17667459

申请日：2022-02-08

Applicant: SEMES CO., LTD.

Inventor： Sang Min Lee ,  Seung Hoon Oh ,  Yong Joon Im ,  Hyo Won Yang

IPC: H01L21/67 ,  B08B3/04 ,  F26B5/00

CPC classification number: H01L21/67028 ,  H01L21/67023 ,  B08B3/04 ,  F26B5/005 ,  H01L21/6719

Abstract: A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.

公开(公告)号：US12087555B2

公开(公告)日：2024-09-10

申请号：US18083301

申请日：2022-12-16

Applicant: Applied Materials, Inc.

Inventor： Kalyanjit Ghosh ,  Shailendra Srivastava ,  Tejas Ulavi ,  Yusheng Zhou ,  Amit Kumar Bansal ,  Sanjeev Baluja

IPC: H01J37/32 ,  B08B7/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  G03F7/42

CPC classification number: H01J37/32495 ,  H01J37/32862 ,  H01L21/67017 ,  B08B7/0021 ,  G03F7/427 ,  H01J37/32834 ,  H01L21/67028 ,  H01L21/6831 ,  H01L21/68742

Abstract: Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.

公开(公告)号：US20240251595A1

公开(公告)日：2024-07-25

申请号：US18604923

申请日：2024-03-14

Applicant: Samsung Display Co., LTD.

Inventor： YOUNG SEO CHOI ,  SUNGCHUL KIM ,  KWANHEE LEE

IPC: H10K50/80 ,  H01L21/67 ,  H10K50/86 ,  H10K71/00

CPC classification number: H10K50/868 ,  H01L21/67028 ,  H10K50/865 ,  H10K71/00

Abstract: An electronic apparatus includes: an electronic module; a display panel disposed on the electronic module and including a first display region and a second display region adjacent to the first display region, the second display region overlapping the electronic module; and a polarization plate disposed on the display panel and including a first polarization region overlapping the first display region and a second polarization region including a polarization part and a non-polarization part having higher light transmittance than the polarization part, the non-polarization part overlapping the second display region.

公开(公告)号：US20240186135A1

公开(公告)日：2024-06-06

申请号：US18497425

申请日：2023-10-30

Applicant: SEMES CO., LTD.

Inventor： Hae Won CHOI ,  Thomas Jongwan KWON ,  Chengyeh HSU

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02101 ,  H01L21/67028

Abstract: A substrate processing method using a supercritical fluid is provided that can deposit a conformal film in a trench with a high aspect ratio and allows complete filling without voids. The substrate processing method comprises performing a supercritical process by repeating a first step, a first vent step, a second step, and a second vent step a plurality of times in order, supplying, in the first step, a first process fluid containing a precursor and a first supercritical fluid to a reactor so that a pressure of the reactor repeats rise and fall within a first pressure range a plurality of times, venting, in the first vent step, the reactor to lower the pressure of the reactor below the first pressure range, supplying, in the second step, a second process fluid containing a reducing fluid to the reactor so that the pressure of the reactor repeats rise and fall within a second pressure range different from the first pressure range a plurality of times, venting, in the second vent step, the reactor to lower the pressure of the reactor below the second pressure range.

公开(公告)号：US11986868B2

公开(公告)日：2024-05-21

申请号：US17180275

申请日：2021-02-19

Applicant: ASM IP Holding B.V.

Inventor： Yukihiro Mori

IPC: H01J37/32 ,  B08B7/00 ,  H01L21/67

CPC classification number: B08B7/0035 ,  H01J37/3244 ,  H01L21/67028

Abstract: Examples of a system dedicated for parts cleaning includes a gas supply apparatus configured to supply a cleaning gas, a first adapter connected to a gas supply port of the gas supply apparatus, an exhaust system configured to exhaust the gas supplied from the gas supply apparatus, and a second adapter connected to a gas inlet of the exhaust system.

公开(公告)号：US11967509B2

公开(公告)日：2024-04-23

申请号：US17029296

申请日：2020-09-23

Applicant: Tokyo Electron Limited

Inventor： Osamu Miyahara

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B1/002 ,  B08B1/02 ,  B08B3/041 ,  H01L21/02057 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/68728 ,  H01L21/02052 ,  H01L21/0209

Abstract: Disclosed is a substrate processing apparatus including: a substrate holding member that holds a peripheral portion of a substrate; a rotating member that includes a plate provided with the substrate holding member and rotates the substrate by rotating the plate; a fluid supply unit that is disposed at a center of the rotating member and supplies a processing liquid and an inert gas to a lower surface of the substrate held by the substrate holding member; and a controller that controls to perform a liquid processing by supplying the processing liquid to the lower surface of the substrate while rotating the substrate, and, after the liquid processing, to perform a drying processing of the substrate while supplying the inert gas to the lower surface of the substrate.

公开(公告)号：US20240112933A1

公开(公告)日：2024-04-04

申请号：US18325200

申请日：2023-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonghee Choi ,  Bongcheol Kim ,  Hyungwan Do

IPC: H01L21/67 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36 ,  H01L21/677

CPC classification number: H01L21/67225 ,  G03F7/2028 ,  G03F7/30 ,  G03F7/36 ,  G03F7/7065 ,  H01L21/67028 ,  H01L21/67069 ,  H01L21/67288 ,  H01L21/67703 ,  G03F7/38

Abstract: A substrate processing system includes a coating apparatus configured to coat a photoresist film on a semiconductor substrate, an exposure apparatus configured to irradiate light onto the photoresist film to form a photoresist pattern region, a developing system configured to remove an unnecessary region from the photoresist film except for the photoresist pattern region to form a photoresist pattern, the developing system including a wet developing apparatus and a dry developing apparatus, the wet developing apparatus configured to remove the unnecessary region using a developing solution, the dry developing apparatus configured to remove the unnecessary region using a developing gas, a cleaning apparatus including a cleaning chamber and configured to remove an edge bead of the photoresist film or the photoresist pattern on an edge region of the semiconductor substrate, and a heating apparatus configured to heat the photoresist film or the photoresist pattern.

公开(公告)号：US11923208B2

公开(公告)日：2024-03-05

申请号：US15599980

申请日：2017-05-19

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes ,  Erik Scott Nelson ,  Steven Kenneth Christie ,  Brent Allan Best

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  C01B7/19 ,  C11D3/39 ,  H01L21/30 ,  H01L21/304

CPC classification number: H01L21/67046 ,  B08B1/04 ,  C01B7/191 ,  C11D3/391 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67253 ,  B08B1/007 ,  H01L21/30 ,  H01L21/67

Abstract: Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

公开(公告)号：US20240066561A1

公开(公告)日：2024-02-29

申请号：US18261578

申请日：2022-01-05

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Inatomi

IPC: B08B3/02 ,  C23C18/18 ,  H01L21/67

CPC classification number: B08B3/022 ,  C23C18/1875 ,  H01L21/67028

Abstract: A substrate processing apparatus includes a substrate holder, a rotational driving unit, a cover body, a transfer mechanism, a cleaning liquid supply and a controller. The substrate holder is configured to hold a substrate. The rotational driving unit is configured to rotate the substrate holder. The cover body is configured to cover a top surface of the substrate held by the substrate holder. The transfer mechanism is configured to transfer a cleaning jig to the substrate holder. The cleaning liquid supply is configured to supply a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder. The controller is configured to control the rotational driving unit to rotate the substrate holder. The cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.

公开(公告)号：US11883552B2

公开(公告)日：2024-01-30

申请号：US16349454

申请日：2019-02-19

Applicant: Ecolab USA Inc.

Inventor： Wenbin Wei ,  Ying Zhang ,  Zhili Ding ,  Huarong Yu

IPC: A61L2/22 ,  A61L2/16 ,  A61L2/24 ,  B08B9/00 ,  B08B9/08 ,  B08B9/093 ,  B08B13/00 ,  B65B55/02 ,  A61L12/08 ,  B65B55/04 ,  B65B55/10 ,  B65D81/24 ,  G08B5/22 ,  H01L21/67

CPC classification number: A61L2/22 ,  A61L2/16 ,  A61L2/24 ,  B08B9/00 ,  B08B9/08 ,  B08B9/0861 ,  B08B9/093 ,  B08B13/00 ,  B65B55/02 ,  B65B55/04 ,  B65B55/10 ,  B65D81/24 ,  G08B5/223 ,  A61L12/086 ,  A61L2202/14 ,  A61L2202/15 ,  A61L2202/16 ,  A61L2202/17 ,  A61L2202/23 ,  B08B2209/08 ,  H01L21/6704 ,  H01L21/67028

Abstract: A method is provided for operating a system to automatically conduct hygiene cycles for a confined space such an interior space of a box suitable for storing and/or carrying packaged food. The system may include a hygiene device that can be attached to the box to conduct the hygiene cycles and a mobile device that can wirelessly communicate with the hygiene device to control the conduction of the hygiene cycles. The method may include automatically collecting information related to the hygiene cycles using the hygiene device and transmitting the collected information to a network directly or through the mobile device.