利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.011 秒)

    Removable modules with external I/O flexibility via an integral second-level removable slot
    4.
    发明申请
    Removable modules with external I/O flexibility via an integral second-level removable slot 有权
    具有外部I / O灵活性的可移动模块，通过集成的二级可移动插槽

    公开(公告)号：US20060164891A1

    公开(公告)日：2006-07-27

    申请号：US11226061

    申请日：2005-09-13

    申请人： Kevin Mills ,  Michael Gifford

    发明人： Kevin Mills ,  Michael Gifford

    IPC分类号： G11C16/04

    CPC分类号： H05K5/0282 ,  G01C21/20 ,  H05K5/0286 ,  Y10S439/946

    摘要： The functionality provided to electronic devices by application specific removable modules is enhanced by viewing the removable modules as first-level removable modules and providing them with at least one second-level removable slot for selectively nesting second-level removable modules having particular external I/O capabilities. The functionality provided to the electronic devices by such a first-level removable module can thus be provided in part by the application specific circuitry within the removable module and further in part by the type of external I/O of the second-level removable module.

    摘要翻译： 通过将可拆卸模块视为第一级可移动模块，并为其提供至少一个第二级可移动插槽，以便有选择地嵌套具有特定外部I / O的第二级可拆卸模块，从而增强了通过应用特定可移除模块提供给电子设备的功能 能力 因此，由这种第一级可移除模块提供给电子设备的功能可以部分地由可移除模块内的应用特定电路提供，并且部分地由第二级可移除模块的外部I / O的类型提供。

    Leadframe and method for reducing mold compound adhesion problems
    5.
    发明申请
    Leadframe and method for reducing mold compound adhesion problems 审中-公开

    公开(公告)号：US20060082021A1

    公开(公告)日：2006-04-20

    申请号：US11291695

    申请日：2005-11-30

    申请人： Vernon Williams ,  Michael Gifford

    发明人： Vernon Williams ,  Michael Gifford

    IPC分类号： H01L21/56

    CPC分类号： H01L21/4842 ,  H01L21/565 ,  H01L23/49565 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2924/0002 ,  Y02P70/605 ,  Y10T29/49121 ,  Y10T29/49146 ,  H01L2924/00

    摘要： An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater degree, mold compound not removed during a deflashing procedure does not flake off to form mold compound debris during a trimming and forming procedure. By adhering to mold compounds to a lesser degree, substantially all of the mold compound is removed during the deflashing procedure so there is no mold compound to flake off to form mold compound debris during the trimming and forming procedure. The leadframe rails may be treated by forming apertures in the rails, by increasing or decreasing the roughness of the leadframe rails, or by coating the leadframe rails with an adhesion promoting or reducing material.