公开(公告)号：US20070062033A1

公开(公告)日：2007-03-22

申请号：US11602549

申请日：2006-11-21

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H05K3/10

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： Methods for forming conductive elements of substrates of components that are configured for use in electronic devices includes providing unconsolidated material over at least a portion of such a substrate and at least partially consolidating the material selectively or in accordance with a program. Such consolidation may be effected by directing consolidating energy, in the form of focused (e.g., laser) radiation or otherwise, toward the unconsolidated material. Additionally, all or part of a substrate may be formed by programmed material consolidation processes.

摘要翻译： 用于形成构造用于电子设备的部件的基底的导电元件的方法包括在这种基底的至少一部分上提供未固结的材料，并且至少部分地根据程序固化材料。 可以通过以聚焦（例如，激光）辐射或其他方式将能量固结到未松散的材料来实现这种整合。 此外，可以通过程序化材料固结方法形成衬底的全部或部分。

公开(公告)号：US20060237832A1

公开(公告)日：2006-10-26

申请号：US11473469

申请日：2006-06-23

申请人： Stephen James ,  Vernon Williams

发明人： Stephen James ,  Vernon Williams

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

公开(公告)号：US20050026414A1

公开(公告)日：2005-02-03

申请号：US10925572

申请日：2004-08-24

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L21/4763

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： Methods for fabricating conductive structures on contact pads of semiconductor device components or other electronic components and for securing conductive structures to contact pads include directing consolidating energy toward unconsolidated conductive material. Alternatively, an unconsolidated material that will consolidate without additional consolidating energy may be used to form such conductive structures, in which case layers of the unconsolidated material are merely defined. Consolidating energy may be directed or layers of unconsolidated conductive material defined by recognizing the locations or orientations of one or more features, such as a contact, of the semiconductor device component or other electronic component. The conductive elements may include, but are not limited to, discrete conductive structures that protrude from the contacts, conductive traces that extend laterally from the contacts, or vias of circuit boards, interposers, or semiconductor devices.

摘要翻译： 用于在半导体器件部件或其他电子部件的接触焊盘上制造导电结构并用于将导电结构固定到接触焊盘的方法包括将固化能量引向未固结的导电材料。 或者，可以使用将在没有额外的固结能量的情况下固结的未固结的材料来形成这种导电结构，在这种情况下仅限定未固结材料的层。 通过识别半导体器件部件或其他电子部件的一个或多个特征（例如接触）的位置或取向来限定固化能量或未固结的导电材料层。 导电元件可以包括但不限于从触点突出的离散的导电结构，从触点横向延伸的导电迹线或电路板，插入件或半导体器件的通孔。

公开(公告)号：US20070148818A1

公开(公告)日：2007-06-28

申请号：US11709046

申请日：2007-02-20

申请人： Vernon Williams ,  Ford Grigg ,  Bret Street

发明人： Vernon Williams ,  Ford Grigg ,  Bret Street

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/11554 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/12 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of electrically connecting corresponding contact pads of semiconductor device components to each other includes interconnecting first and second members of an interconnection element. The first and second members respectively protrude from first and second semiconductor device components, with a conductive element of each member in communication with a contact pad of its corresponding semiconductor device component. Each member of the interconnection element also includes an insulative coating, or shell. When the first and second member of an interconnection element are interconnected, the insulative coating, or shell, may substantially cover or encase the conductive elements of the interconnection element.

摘要翻译： 将半导体器件部件的对应接触焊盘彼此电连接的方法包括互连互连元件的第一和第二部件的互连。 第一和第二构件分别从第一和第二半导体器件部件突出，每个部件的导电元件与其对应的半导体器件部件的接触焊盘连通。 互连元件的每个构件还包括绝缘涂层或壳体。 当互连元件的第一和第二构件互连时，绝缘涂层或外壳可以基本上覆盖或封装互连元件的导电元件。

公开(公告)号：US20050230806A1

公开(公告)日：2005-10-20

申请号：US11140823

申请日：2005-05-31

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L29/76

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： Conductive elements that include a plurality of adjacent, mutually adhered regions are disclosed. All of the regions may include the same type of material. At least a portion of such a conductive element may be configured to extend laterally. In a semiconductor device assembly, such a conductive element is in electrical communication with a contact of at least one semiconductor device component, and may extend between corresponding contacts of two or more semiconductor device components.

摘要翻译： 公开了包括多个相邻的相互粘合区域的导电元件。 所有的区域可以包括相同类型的材料。 这种导电元件的至少一部分可被配置为横向延伸。 在半导体器件组件中，这种导电元件与至少一个半导体器件部件的触点电连通，并且可以在两个或更多个半导体器件部件的相应触点之间延伸。

公开(公告)号：US20050023562A1

公开(公告)日：2005-02-03

申请号：US10931820

申请日：2004-09-01

申请人： Stephen James ,  Vernon Williams

发明人： Stephen James ,  Vernon Williams

IPC分类号： H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L25/065 ,  H01L31/109

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

摘要翻译： 提供半导体器件，半导体管芯封装，模具加工以及制造器件和封装的方法。 在一个实施例中，半导体器件包括安装在柔性带基板的相对侧上的一对半导体管芯，该管芯的外表面上设置有一个或多个支座。 当设备位于模具板之间时，支座可以与模具的模具的内表面接触，以将柔性带基板保持在模具室内的集中位置，并且阻止带材弯曲成为 在封装期间，模塑料流入室中。

公开(公告)号：US20050006736A1

公开(公告)日：2005-01-13

申请号：US10900773

申请日：2004-07-27

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L21/48 ,  H01L29/94

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： Selectively consolidated conductive elements. The conductive elements may include multiple, mutually adhered regions that comprise conductive material, such as a thermoplastic conductive elastomer or a metal. In semiconductor device assemblies, the conductive elements may electrically connect contacts of semiconductor device components to one another. The conductive elements may alternatively comprise conductive traces or vias of circuit boards or interposers. Selective consolidation processes may be employed to fabricate the conductive elements. Such processes may include use of a machine vision system with at least one camera operably associated with a computer controlling consolidation or application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the conductive element is to be fabricated.

摘要翻译： 选择性整合导电元件。 导电元件可以包括多个彼此粘附的包含导电材料的区域，例如热塑性导电弹性体或金属。 在半导体器件组件中，导电元件可将半导体器件部件的触点彼此电连接。 导电元件可以可选地包括电路板或插入件的导电迹线或通路。 可以采用选择性固结方法来制造导电元件。 这样的过程可以包括使用机器视觉系统，其中至少一个摄像机可操作地与控制材料的合并或应用的计算机相关联，使得系统可以识别半导体器件组件，半导体管芯等的位置，取向和特征 要在其上制造导电元件的基板。

公开(公告)号：US08769846B1

公开(公告)日：2014-07-08

申请号：US13093929

申请日：2011-04-26

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： A43B3/12

CPC分类号： A43B7/26 ,  A43B7/1455 ,  A43B7/146

摘要： The boot having skin-exfoliating means therein is a normal boot that when worn targets different regions of a foot and exfoliates dead skin from said regions of the foot, but in different exfoliating manners. The exfoliating means are designed to massage and exfoliate dead skin from the foot of an end user. The exfoliating means comprise massaging nodes aligned along a front, interior of the boot, which target skin between toes. Another exfoliating means is included along a middle region of the sole and includes an array of nodes that exfoliate skin along a bottom surface of the foot. Exfoliating ridges are located on two regions of the sole and are adapted to exfoliate skin at the rear of the foot and between the array of nodes and massaging nodes. Edge ridges adorn a periphery of the sole and provide additional exfoliating means.

摘要翻译： 在其中具有皮肤去角质装置的靴子是正常的靴子，当穿着时，针对脚的不同区域并且从脚的所述区域剥离死皮，但以不同的去角质方式。 去角质装置被设计成从最终用户的脚部按摩和去除死皮。 去角质装置包括按照沿着靴子前部，内部对准的节段，其在脚趾之间定向皮肤。 沿着鞋底的中间区域包括另外的去角质装置，并且包括沿脚底部表面剥离皮肤的节点阵列。 去角质脊位于鞋底的两个区域上，并且适于在脚后部以及节点阵列和按摩节点之间剥离皮肤。 边缘脊装饰鞋底的周边，并提供额外的去角质装置。

公开(公告)号：US20070148817A1

公开(公告)日：2007-06-28

申请号：US11708917

申请日：2007-02-20

申请人： Vernon Williams ,  Ford Grigg ,  Bret Street

发明人： Vernon Williams ,  Ford Grigg ,  Bret Street

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/11554 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/12 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for fabricating an electrical interconnection element, or conductive structure, includes disposing a jacket of a first member of the electrical interconnection element laterally around a contact of a semiconductor device structure and introducing conductive material into the jacket. The jacket, which may be electrically insulative, may include a plurality of adjacent, mutually adhered regions. Such regions may be formed by programmed material consolidation processes, such as stereolithography, in which material is selectively consolidated in a manner controlled by a program. The first member is configured to interconnect with a second member of the electrical interconnection element, which may be secured to and electrically communicate with a contact of another semiconductor device component.

摘要翻译： 一种用于制造电互连元件或导电结构的方法包括将电互连元件的第一构件的护套横向放置在半导体器件结构的接触件周围并将导电材料引入护套中。 可以是电绝缘的护套可以包括多个相邻的相互粘合的区域。 这样的区域可以通过程序化材料固结方法形成，例如立体光刻，其中材料以程序控制的方式选择性地固结。 第一构件被配置为与电互连元件的第二构件互连，电连接元件的第二构件可固定到另一个半导体器件部件的触点并与之电连通。

公开(公告)号：US20050221531A1

公开(公告)日：2005-10-06

申请号：US11141300

申请日：2005-05-31

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L21/00

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： A carrier substrate includes a substrate and at least one conductive element. The at least one conductive element may include a plurality of adjacent, mutually adhered regions, which may include the same type of material. A portion of the at least one conductive element may be disposed within a recess formed in a surface of the substrate. The at least one conductive element may include a portion that extends through the substrate.

摘要翻译： 载体基板包括基板和至少一个导电元件。 至少一个导电元件可以包括多个相邻的，相互粘合的区域，其可以包括相同类型的材料。 所述至少一个导电元件的一部分可以设置在形成在所述基板的表面中的凹部内。 所述至少一个导电元件可以包括延伸穿过衬底的部分。