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公开(公告)号:US20080130708A1
公开(公告)日:2008-06-05
申请号:US11979324
申请日:2007-11-01
IPC分类号: G01K1/00
CPC分类号: G01K1/14 , C09D5/26 , F01D21/003 , F05D2260/80 , G01K11/06 , G01K11/12 , G01K13/02 , G01K2013/024
摘要: A temperature measuring arrangement measures the temperature of a fluid passing a component. The arrangement comprises a temperature measuring device having a substrate of low thermal capacity that has applied thereto two or more temperature recording media. The device is attached to and spaced apart from the component and is in the fluid flow.
摘要翻译: 温度测量装置测量通过部件的流体的温度。 该装置包括具有低热容量基板的温度测量装置,其已经施加到两个或多个温度记录介质上。 该装置附接到部件并与该部件间隔开并处于流体流中。