公开(公告)号：US08705776B2

公开(公告)日：2014-04-22

申请号：US13306017

申请日：2011-11-29

申请人： Michael Knauss ,  Scott Naugle ,  Andy Doller ,  Eric Ochs

发明人： Michael Knauss ,  Scott Naugle ,  Andy Doller ,  Eric Ochs

IPC分类号： H04R1/02 ,  H04R19/00 ,  H04R19/04 ,  H04R1/28

CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R1/2807 ,  H04R1/406 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014 ,  H01L2924/00

摘要： A System and method to provide a cost-effective implementation of a microphone package, very good microphone performance being achieved even with a high degree of miniaturization. A microphone package includes a MEMS microphone component having a microphone diaphragm, and a housing having a housing base and a housing cover, the housing enclosing the back-side volume of the microphone component, and an acoustic access channel to the microphone diaphragm being provided in the housing which is closed off with respect to the back-side volume and which connects at least one sound opening in the housing to one side of the microphone diaphragm. An interposer is mounted inside the housing which defines the acoustic access channel to the microphone diaphragm in that the interposer is coupled to the sound opening in the housing, and has at least one exit opening above which the microphone component together with the microphone diaphragm is mounted.

摘要翻译： 一种提供麦克风封装的成本有效的实现的系统和方法，即使在高度小型化的情况下也能实现非常好的麦克风性能。 麦克风封装包括具有麦克风隔膜的MEMS麦克风组件，以及具有壳体底座和壳体盖的壳体，该壳体包围麦克风组件的背面体积，以及提供到麦克风隔膜的声学通道 所述壳体相对于后侧体积被封闭，并且将所述壳体中的至少一个声音开口连接到所述麦克风隔膜的一侧。 插入器安装在壳体内部，其限定到麦克风隔膜的声学通道，因为插入器耦合到壳体中的声音开口，并且具有至少一个出口，在该出口处，麦克风组件与麦克风隔膜一起被安装 。