公开(公告)号：US6051067A

公开(公告)日：2000-04-18

申请号：US64624

申请日：1998-04-23

申请人： Michael Mou ,  Bill Yuan Chung Chuang ,  Arnold Chang Mou Yang ,  Jing Yuang Ho

发明人： Michael Mou ,  Bill Yuan Chung Chuang ,  Arnold Chang Mou Yang ,  Jing Yuang Ho

IPC分类号： B25B11/00 ,  H01L21/683 ,  B05C13/00

CPC分类号： B25B11/005 ,  H01L21/6838

摘要： A wafer securing device and method for securing a planar plate on a wafer having a hollowed-out portion, the device including a substrate for receiving the wafer; a groove provided on the substrate and having an opening, the hollowed-out portion corresponding to the groove when the wafer is placed on the substrate; and an air extracting equipment for extracting air from the groove when the wafer is placed on the substrate so that the planar plate placed on the wafer is secured to the wafer by means of a vacuum suction force.

摘要翻译： 一种用于将平板固定在具有中空部分的晶片上的晶片固定装置和方法，该装置包括用于接收晶片的基板; 设置在所述基板上并且具有开口的凹槽，当所述晶片被放置在所述基板上时，所述中空部分对应于所述凹槽; 以及空气提取设备，用于当将晶片放置在基板上时从槽中提取空气，使得通过真空抽吸力将放置在晶片上的平板固定到晶片。