Transparent heatsink/structure/interconnect for tiling space based optical components
    2.
    发明授权
    Transparent heatsink/structure/interconnect for tiling space based optical components 有权
    用于平铺空间光学元件的透明散热器/结构/互连

    公开(公告)号:US08059254B1

    公开(公告)日:2011-11-15

    申请号:US12478397

    申请日:2009-06-04

    CPC分类号: G02F1/292 G02F1/13336

    摘要: A transmissive beam steering aperture includes a common superstrate provided from an optical material and having first and second opposing surfaces with at least one of the first and second surfaces having an electrode coating provided thereon to provide the at least one surface as a common electrode surface and having a first plurality of electrically isolated common electrodes. One or more electrode containing substrates is disposed over respective ones of the first plurality of electrically isolated common electrodes to form one or more one liquid crystal (LC) cells. In one embodiment, the transmissive beam steering aperture is used as an aperture in an optical phased array.

    摘要翻译: 透射光束转向孔包括从光学材料提供的公共顶板,并且具有第一和第二相对表面,其中第一和第二表面中的至少一个具有设置在其上的电极涂层,以将至少一个表面提供为公共电极表面, 具有第一多个电隔离的公共电极。 一个或多个含电极的衬底设置在第一多个电隔离的公共电极中的相应的电极上以形成一个或多个液晶(LC)单元。 在一个实施例中,透射光束转向孔径被用作光学相控阵列中的孔径。

    Hermetic liquid crystal cell and sealing technique
    3.
    发明授权
    Hermetic liquid crystal cell and sealing technique 有权
    密封液晶和密封技术

    公开(公告)号:US08031319B1

    公开(公告)日:2011-10-04

    申请号:US12474643

    申请日:2009-05-29

    IPC分类号: G02F1/1339

    摘要: Described herein are structures and techniques for providing an LC cell having a hermetically sealed cover disposed over a fill hole provided in a superstrate. The superstrate and cover have adhesion layers disposed thereon. Solder is disposed or otherwise provided around the fill hole (e.g. either on the cover or the superstrate or as a separate piece). The cover is then disposed over the fill hole and the solder is reflowed to form the hermetic seal over the fill hole.

    摘要翻译: 这里描述的是用于提供LC单元的结构和技术,该LC单元具有设置在设置在顶板上的填充孔上的气密密封盖。 覆盖物和覆盖层具有设置在其上的粘附层。 焊料被设置或以其它方式设置在填充孔周围(例如在盖或覆盖物上或作为单独的片)。 然后将盖布置在填充孔上方,并且焊料被回流以在填充孔上形成气密密封。