公开(公告)号：US06572456B2

公开(公告)日：2003-06-03

申请号：US09927142

申请日：2001-08-10

申请人： Michael Weber-Grabau ,  Ivelin A. Anguelov ,  Edric H. Tong ,  Adam E. Norton ,  Fred E. Stanke ,  Badru D. Hyatt

发明人： Michael Weber-Grabau ,  Ivelin A. Anguelov ,  Edric H. Tong ,  Adam E. Norton ,  Fred E. Stanke ,  Badru D. Hyatt

IPC分类号： B24B700

CPC分类号： B24B37/013 ,  B24B49/02 ,  B24B49/12

摘要： A wafer measurement apparatus (10, 110) and method for measuring a film thickness property of a wafer (30) that does not require a water bath or complicated wafer handling apparatus. The apparatus includes a chuck (16) having an upper surface (20) for supporting the wafer, and a perimeter (18). Also included is a metrology module (50) for measuring one or more film thickness properties. The metrology module is arranged adjacent the chuck upper surface and has a measurement window (60) with a lower surface (64) arranged substantially parallel to the chuck upper surface, thereby defining an open volume (68). The apparatus includes a water supply system in fluid communication with the open volume via nozzles (70) for flowing water through and back-filling the volume in a manner that does not produce bubbles within the volume. A catchment (40) surrounding the chuck may be used to catch water flowing out of the volume. Methods of performing measurements of one or more wafer film properties are also described.

公开(公告)号：US4907931A

公开(公告)日：1990-03-13

申请号：US195703

申请日：1988-05-18

申请人： Chester L. Mallory ,  Edric H. Tong ,  Wayne K. Borglum

发明人： Chester L. Mallory ,  Edric H. Tong ,  Wayne K. Borglum

IPC分类号： H01L21/677 ,  H01L21/687

CPC分类号： H01L21/68707 ,  H01L21/67766 ,  Y10S414/136

摘要： A semiconductor wafer handling apparatus for automated movement of semiconductor wafers between wafer cassette trays and wafer test systems is provided. The apparatus includes a platform for carrying at least one semiconductor wafer cassette tray, a wafer alignment device carried by the platform for aligning a semiconductor wafer in a predetermined test position and a wafer transfer device associated with the platform and the wafer alignment device for transferring the wafer between the cassette tray, the alignment device and the test system. The wafer transfer device is operational in the same plane relative to the platform and capable of extending, retracting and rotating in the plane. In includes a shuttle arm assembly mounted for translational and rotational movement so that it may be selectively aligned with the cassette tray, the alignment device and the test system and further includes a device for controlling the translational and rotational movement of the shuttle arm assembly for selectively extending, retracting the rotating the shuttle arm assembly relative to each of the cassette tray, the alignment device and the test system so that in response to signals from the control device, the shuttle arm assembly can be selectively actuated to translate to a cassette tray position and secure and remove a semiconductor wafer from the cassette tray, translate to a wafer alignment position and insert, release, secure and remove the wafer from the alignment device, and translate and rotate to a wafer test position and place the wafer on, release, secure, and lift the wafer off the test system.

摘要翻译： 提供了一种半导体晶片处理装置，用于在晶片盒托盘和晶片测试系统之间自动移动半导体晶片。 该装置包括用于承载至少一个半导体晶片盒托盘的平台，由平台承载的晶片对准装置，用于将预定测试位置的半导体晶片对准，以及与该平台相关联的晶片传送装置和晶片对准装置， 在盒托盘，对准装置和测试系统之间的晶片。 晶片传送装置相对于平台在相同的平面中可操作并且能够在平面中延伸，缩回和旋转。 其包括一个安装成平移和旋转运动的梭臂组件，使得它可以选择性地与盒托盘，对准装置和测试系统对齐，并且还包括用于控制梭臂组件的平移和旋转运动的装置，用于选择性地 延伸，缩回相对于盒托盘，对准装置和测试系统中的每一个旋转梭臂组件，使得响应于来自控制装置的信号，梭臂组件可以被选择性地致动以平移到盒托盘位置 并且从盒托盘固定和移除半导体晶片，转移到晶片对准位置，并从对准装置插入，释放，固定和移除晶片，并平移并旋转到晶片测试位置并将晶片放置， 安全，并将晶片从测试系统上提起。