公开(公告)号：US10735004B1

公开(公告)日：2020-08-04

申请号：US16408096

申请日：2019-05-09

Applicant: Microchip Technology Inc.

Inventor： Matthew Kian Chin Yap ,  Alan Nakamoto

IPC: H03K19/20 ,  H01J37/30 ,  H03K19/17748 ,  H03K19/17728

Abstract: An integrated circuit includes a plurality of logic function circuits disposed on the integrated circuit and interconnected by metal interconnect lines to form a logic network. A plurality of configurable logic function circuits is also disposed on the integrated circuit, each configurable logic function circuit being disposed on a respective area on the integrated circuit and not interconnected by the metal interconnect lines to form the logic network.