公开(公告)号：US12088285B2

公开(公告)日：2024-09-10

申请号：US17548988

申请日：2021-12-13

Applicant: Microchip Technology Inc.

Inventor： Tamir Langer ,  Migel Jacubovski

IPC: H03K17/082 ,  G01K7/01 ,  H02H5/04 ,  H03K17/08

CPC classification number: H03K17/0822 ,  G01K7/01 ,  H02H5/044 ,  H03K2017/0806

Abstract: A method provides thermal protection for an IC device that has multiple components. For each component, temperatures are sensed, each of which associated with a different area of the respective component and a respective temperature sense signal is output indicative of the highest sensed temperature of the respective component. For each of the components, the respective temperature sense output signal is sampled to produce a sequence of discrete sampled temperature values. A sequence of differences between a reference temperature value and each of the discrete sample temperatures is integrated over time to compute, for each of the components, a respective integration output. The respective integration output computed for each of the switches is compared to a threshold value. An action related to the thermal protection function is initiated upon the integration output of an affected component exceeding the threshold value.