公开(公告)号：US20220179997A1

公开(公告)日：2022-06-09

申请号：US17457298

申请日：2021-12-02

Applicant: Microchip Technology Incorporated

Inventor： Brian Branscomb ,  William Mahany ,  Sailesh Rupani

IPC: G06F21/64

Abstract: Examples of the present disclosure relate generally to implementing higher-layer processing on time-sensitive data blocks at a physical-layer-interface device. Some examples include logic to perform operations, the operations including providing data blocks to a physical-layer-interface device. The operations may also include adding dummy data into one or more time-sensitive data blocks of the data blocks being provided to the physical-layer-interface device. A size of the dummy data corresponding to a size of higher-layer-processing data. Other example operations may include removing higher-layer-processing data from a first ingressing data block. The other operations may also include removing a portion of the first ingressing data block and adding the portion to a subsequent ingressing data block. A size of the portion corresponding to the size of integrity-detection data. The other operations may also include removing the integrity-detection data from an ingressing data block. Related methods, systems, and devices are also disclosed.