公开(公告)号：US20240371914A1

公开(公告)日：2024-11-07

申请号：US18652081

申请日：2024-05-01

Applicant: Micron Technology, Inc.

Inventor： Carlos Franco ,  Dale Arnold ,  Dan Soto

IPC: H01L25/18 ,  H10B80/00 ,  H01L23/00

Abstract: Systems, methods, and apparatus are provided for a bond wire induction apparatus. A particular induction apparatus can include a memory package comprising a substrate and a plurality of memory layers, a plurality of conductive nodes connected by a plurality of conductive traces to form a first portion of an induction device. In this embodiment, the first portion of the inductive device comprises an inductive coil within at least two layers of the plurality of memory layers of the memory package. In addition, the apparatus can include a plurality of bond traces to couple a first portion of the plurality of conductive nodes to a second portion of the plurality of conductive nodes to form a second portion of the inductive device, such that the second portion of the inductive device comprises an inductive bond wire in a physical area that is physically outside the memory package.

公开(公告)号：US20240071679A1

公开(公告)日：2024-02-29

申请号：US17895966

申请日：2022-08-25

Applicant: Micron Technology, Inc.

Inventor： Carlos Franco

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F27/28 ,  H01F41/04

Abstract: Systems, methods, and apparatus are provided for a conductive node induction apparatus. A particular induction apparatus can include a first plurality of conductive nodes that include a corresponding first edge and second edge, a second plurality of conductive nodes that include a corresponding first edge and second edge, wherein the first plurality of conductive nodes are separated from the second plurality of conductive nodes by a space, a first conductive trace coupled to a first edge a first conductive node of the first plurality of conductive nodes and coupled to a second edge of a first conductive node of the second plurality of conductive nodes, and a second conductive trace coupled to a first edge of the first conductive node of the second plurality of conductive nodes and coupled to a second edge of a second conductive node of the first plurality of conductive nodes.