公开(公告)号：US20240371914A1

公开(公告)日：2024-11-07

申请号：US18652081

申请日：2024-05-01

Applicant: Micron Technology, Inc.

Inventor： Carlos Franco ,  Dale Arnold ,  Dan Soto

IPC: H01L25/18 ,  H10B80/00 ,  H01L23/00

Abstract: Systems, methods, and apparatus are provided for a bond wire induction apparatus. A particular induction apparatus can include a memory package comprising a substrate and a plurality of memory layers, a plurality of conductive nodes connected by a plurality of conductive traces to form a first portion of an induction device. In this embodiment, the first portion of the inductive device comprises an inductive coil within at least two layers of the plurality of memory layers of the memory package. In addition, the apparatus can include a plurality of bond traces to couple a first portion of the plurality of conductive nodes to a second portion of the plurality of conductive nodes to form a second portion of the inductive device, such that the second portion of the inductive device comprises an inductive bond wire in a physical area that is physically outside the memory package.