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Patent Agency Ranking
公开(公告)号：US20240049468A1
公开(公告)日：2024-02-08
申请号：US18381791
申请日：2023-10-19
Applicant: Micron Technology, Inc.
Inventor： Shuangqiang Luo , Dong Wang , Rui Zhang , Da Xing , Xiao Li , Pei Qiong Cheung , Xiao Zeng
Abstract: Some embodiments include an assembly having conductive structures distributed along a level within a memory array region and another region proximate the memory array region. The conductive structures include a first stack over a metal-containing region. A semiconductor material is within the first stack. A second stack is over the conductive structures, and includes alternating conductive tiers and insulative tiers. Cell-material-pillars are within the memory array region. The cell-material-pillars include channel material. The semiconductor material directly contacts the channel material. Conductive post structures are within the other region. Some of the conductive post structures are dummy structures and have bottom surfaces which are entirely along an insulative oxide material. Others of the conductive post structures are live posts electrically coupled with CMOS circuitry. Some embodiments include methods of forming assemblies.
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公开(公告)号：US11889691B2
公开(公告)日：2024-01-30
申请号：US17211580
申请日：2021-03-24
Applicant: Micron Technology, Inc.
Inventor： Shuangqiang Luo , Dong Wang , Rui Zhang , Da Xing , Xiao Li , Pei Qiong Cheung , Xiao Zeng
Abstract: Some embodiments include an assembly having conductive structures distributed along a level within a memory array region and another region proximate the memory array region. The conductive structures include a first stack over a metal-containing region. A semiconductor material is within the first stack. A second stack is over the conductive structures, and includes alternating conductive tiers and insulative tiers. Cell-material-pillars are within the memory array region. The cell-material-pillars include channel material. The semiconductor material directly contacts the channel material. Conductive post structures are within the other region. Some of the conductive post structures are dummy structures and have bottom surfaces which are entirely along an insulative oxide material. Others of the conductive post structures are live posts electrically coupled with CMOS circuitry. Some embodiments include methods of forming assemblies.
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公开(公告)号：US20250056802A1
公开(公告)日：2025-02-13
申请号：US18930589
申请日：2024-10-29
Applicant: Micron Technology, Inc.
Inventor： Shuangqiang Luo , Dong Wang , Rui Zhang , Da Xing , Xiao Li , Pei Qiong Cheung , Xiao Zeng
Abstract: Some embodiments include an assembly having conductive structures distributed along a level within a memory array region and another region proximate the memory array region. The conductive structures include a first stack over a metal-containing region. A semiconductor material is within the first stack. A second stack is over the conductive structures, and includes alternating conductive tiers and insulative tiers. Cell-material-pillars are within the memory array region. The cell-material-pillars include channel material. The semiconductor material directly contacts the channel material. Conductive post structures are within the other region. Some of the conductive post structures are dummy structures and have bottom surfaces which are entirely along an insulative oxide material. Others of the conductive post structures are live posts electrically coupled with CMOS circuitry. Some embodiments include methods of forming assemblies.
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公开(公告)号：US12167604B2
公开(公告)日：2024-12-10
申请号：US18381791
申请日：2023-10-19
Applicant: Micron Technology, Inc.
Inventor： Shuangqiang Luo , Dong Wang , Rui Zhang , Da Xing , Xiao Li , Pei Qiong Cheung , Xiao Zeng
Abstract: Some embodiments include an assembly having conductive structures distributed along a level within a memory array region and another region proximate the memory array region. The conductive structures include a first stack over a metal-containing region. A semiconductor material is within the first stack. A second stack is over the conductive structures, and includes alternating conductive tiers and insulative tiers. Cell-material-pillars are within the memory array region. The cell-material-pillars include channel material. The semiconductor material directly contacts the channel material. Conductive post structures are within the other region. Some of the conductive post structures are dummy structures and have bottom surfaces which are entirely along an insulative oxide material. Others of the conductive post structures are live posts electrically coupled with CMOS circuitry. Some embodiments include methods of forming assemblies.
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公开(公告)号：US20220310642A1
公开(公告)日：2022-09-29
申请号：US17211580
申请日：2021-03-24
Applicant: Micron Technology, Inc.
Inventor： Shuangqiang Luo , Dong Wang , Rui Zhang , Da Xing , Xiao Li , Pei Qiong Cheung , Xiao Zeng
IPC: H01L27/11582 , H01L27/11556 , H01L27/11526 , H01L27/11573
Abstract: Some embodiments include an assembly having conductive structures distributed along a level within a memory array region and another region proximate the memory array region. The conductive structures include a first stack over a metal-containing region. A semiconductor material is within the first stack. A second stack is over the conductive structures, and includes alternating conductive tiers and insulative tiers. Cell-material-pillars are within the memory array region. The cell-material-pillars include channel material. The semiconductor material directly contacts the channel material. Conductive post structures are within the other region. Some of the conductive post structures are dummy structures and have bottom surfaces which are entirely along an insulative oxide material. Others of the conductive post structures are live posts electrically coupled with CMOS circuitry. Some embodiments include methods of forming assemblies.
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