公开(公告)号：US11361972B2

公开(公告)日：2022-06-14

申请号：US16387766

申请日：2019-04-18

Applicant: Micron Technology, Inc.

Inventor： Jerome A. Imonigie ,  Ramaswamy Ishwar Venkatanarayanan ,  Pranav P. Sharma ,  Eric E. Kron ,  Sanjeev Sapra

IPC: H01L49/02 ,  H01L21/311

Abstract: Some embodiments include a method in which an assembly is formed to have a first silicon-dioxide-containing-material and a second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material has a higher concentration of dopant therein than does the second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material is selectively removed relative to the second silicon-dioxide-containing-material using a mixture which includes hydrofluoric acid, a second acid and an organic solvent. The organic solvent may include at least one ester and/or at least one ether. The second acid may have a pKa of less than about 5.

公开(公告)号：US20200335351A1

公开(公告)日：2020-10-22

申请号：US16387766

申请日：2019-04-18

Applicant: Micron Technology, Inc.

Inventor： Jerome A. Imonigie ,  Ramaswamy Ishwar Venkatanarayanan ,  Pranav P. Sharma ,  Eric E. Kron ,  Sanjeev Sapra

IPC: H01L21/311 ,  H01L49/02

Abstract: Some embodiments include a method in which an assembly is formed to have a first silicon-dioxide-containing-material and a second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material has a higher concentration of dopant therein than does the second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material is selectively removed relative to the second silicon-dioxide-containing-material using a mixture which includes hydrofluoric acid, a second acid and an organic solvent. The organic solvent may include at least one ester and/or at least one ether. The second acid may have a pKa of less than about 5.