公开(公告)号：US20210295879A1

公开(公告)日：2021-09-23

申请号：US17340681

申请日：2021-06-07

Applicant: Micron Technology, Inc.

Inventor： Joe M Jeddeloh ,  Brent Keeth

IPC: G11C5/06 ,  G11C5/14 ,  G11C7/10 ,  H01L25/065 ,  G11C5/02 ,  H01L25/18

Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.