公开(公告)号：US11731231B2

公开(公告)日：2023-08-22

申请号：US16259832

申请日：2019-01-28

Applicant: Micron Technology, Inc.

Inventor： Swetha Barkam ,  Khiam-How Low ,  James A. Cultra

IPC: B24B37/005 ,  B24B37/26 ,  H01L21/306 ,  B24B41/06

CPC classification number: B24B37/005 ,  B24B37/26 ,  B24B41/06 ,  H01L21/30625

Abstract: A chemical-mechanical polishing system includes a rotatable head for mounting a wafer thereto, a polishing pad mounted to a rotatable platen, and a fluid dispenser for dispensing a fluid onto a surface of the polishing pad. The polishing pad includes an array of piezoelectric actuators. The chemical-mechanical polishing system includes a controller operably coupled to each piezoelectric actuator. The controller measures voltages output by the piezoelectric actuators of the array, determines, qualitatively, a topography of the wafer surface based on the measured voltages, and adjusts an aggressiveness of at least one portion of the polishing pad based on the determined topography. The controller adjusts the aggressiveness by inducing the piezoelectric effect or reverse piezoelectric effect in one or more piezoelectric actuators to adjust a surface topography of the polishing pad.

公开(公告)号：US20200238471A1

公开(公告)日：2020-07-30

申请号：US16259832

申请日：2019-01-28

Applicant: Micron Technology, Inc.

Inventor： Swetha Barkam ,  Khiam-How Low ,  James A. Cultra

IPC: B24B37/005 ,  B24B41/06 ,  H01L21/306 ,  B24B37/26

Abstract: A chemical-mechanical polishing system includes a rotatable head for mounting a wafer thereto, a polishing pad mounted to a rotatable platen, and a fluid dispenser for dispensing a fluid onto a surface of the polishing pad. The polishing pad includes an array of piezoelectric actuators. The chemical-mechanical polishing system include a controller operably coupled to each piezoelectric actuator. The controller measures voltages output by the piezoelectric actuators of the array, determines, qualitatively, a topography of the wafer surface based on the measured voltages, and adjusts an aggressiveness of at least one portion of the polishing pad based on the determined topography. The controller adjusts the aggressiveness by inducing the piezoelectric effect or reverse piezoelectric effect in one or more piezoelectric actuators to adjust a surface topography of the polishing pad.