公开(公告)号：US09579825B2

公开(公告)日：2017-02-28

申请号：US14093682

申请日：2013-12-02

Applicant: Micron Technology, Inc.

Inventor： Warren M. Farnworth ,  Tom A. Muntifering ,  Paul J. Clawson

IPC: B28D5/00 ,  B23K26/042 ,  B23Q15/22 ,  H01L21/78 ,  B26F3/00 ,  B23K26/40

CPC classification number: H01L22/20 ,  B23K26/03 ,  B23K26/042 ,  B23K26/044 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  B23Q15/22 ,  B26F3/004 ,  B28D5/0064 ,  H01L21/78 ,  Y10T83/141 ,  Y10T83/178 ,  Y10T83/538

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Abstract translation: 本文公开了用于成像和切割半导体晶片和其它微电子器件基板的方法和系统。 在一个实施例中，用于从衬底分离微电子器件的系统包括具有与X射线检测器间隔开的X射线源的X射线成像系统。 X射线源可以通过衬底和X射线检测器发射X射线束，并且X射线检测器可以产生至少部分衬底的X射线图像。 根据另一实施例的方法包括检测半导体工件的不规则间隔的管芯的间隔信息​​。 该方法还可以包括至少部分地基于间隔信息来自动控制用于对半导体工件的管芯进行分割的工艺。 例如，可以通过非直线切割和/或多个切割器通过从工件分离各个模具。

公开(公告)号：US11450577B2

公开(公告)日：2022-09-20

申请号：US15426317

申请日：2017-02-07

Applicant: Micron Technology, Inc.

Inventor： Warren M. Farnworth ,  Tom A. Muntifering ,  Paul J. Clawson

IPC: H01L21/66 ,  H01L21/78 ,  B28D5/00 ,  B23K26/40 ,  B23Q15/22 ,  B26F3/00 ,  B23K26/044 ,  B23K26/03 ,  B23K26/042 ,  B23K101/40 ,  B23K103/00

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

公开(公告)号：US20140083270A1

公开(公告)日：2014-03-27

申请号：US14093682

申请日：2013-12-02

Applicant: Micron Technology, Inc.

Inventor： Warren M. Farnworth ,  Tom A. Muntifering ,  Paul J. Clawson

IPC: B28D5/00 ,  B23K26/40 ,  B23Q15/22 ,  B26F3/00

CPC classification number: H01L22/20 ,  B23K26/03 ,  B23K26/042 ,  B23K26/044 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  B23Q15/22 ,  B26F3/004 ,  B28D5/0064 ,  H01L21/78 ,  Y10T83/141 ,  Y10T83/178 ,  Y10T83/538

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Abstract translation: 本文公开了用于成像和切割半导体晶片和其它微电子器件基板的方法和系统。 在一个实施例中，用于从衬底分离微电子器件的系统包括具有与X射线检测器间隔开的X射线源的X射线成像系统。 X射线源可以通过衬底和X射线检测器发射X射线束，并且X射线检测器可以产生至少部分衬底的X射线图像。 根据另一实施例的方法包括检测半导体工件的不规则间隔的管芯的间隔信息​​。 该方法还可以包括至少部分地基于间隔信息来自动控制用于对半导体工件的管芯进行分割的工艺。 例如，可以通过非直线切割和/或多个切割器通过从工件分离各个模具。

公开(公告)号：US20170148691A1

公开(公告)日：2017-05-25

申请号：US15426317

申请日：2017-02-07

Applicant: Micron Technology, Inc.

Inventor： Warren M. Farnworth ,  Tom A. Muntifering ,  Paul J. Clawson

IPC: H01L21/66 ,  B28D5/00 ,  H01L21/78 ,  B23K26/03 ,  B23K26/40 ,  B26F3/00 ,  B23K26/044

CPC classification number: H01L22/20 ,  B23K26/03 ,  B23K26/042 ,  B23K26/044 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  B23Q15/22 ,  B26F3/004 ,  B28D5/0064 ,  H01L21/78 ,  Y10T83/141 ,  Y10T83/178 ,  Y10T83/538

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.