公开(公告)号：US20240063165A1

公开(公告)日：2024-02-22

申请号：US17890734

申请日：2022-08-18

Applicant: Micron Technology, Inc.

Inventor： Ramesh NALLAVELLI ,  Nagavenkata Varaprasad NUNE ,  Yeow Chon ONG ,  Hong Wan NG

IPC: H01L23/00 ,  C09J9/02 ,  H01L25/065

CPC classification number: H01L24/32 ,  C09J9/02 ,  H01L24/29 ,  H01L25/0652 ,  H01L25/0657 ,  C09J2203/326 ,  C09J2301/314 ,  H01L24/73 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/13193 ,  H01L2924/1434 ,  H01L2924/07811 ,  H01L2924/07812 ,  H01L2224/32145 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29013 ,  H01L2225/06524 ,  H01L2225/06513 ,  H01L24/13

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, an adhesive assembly configured for semiconductor die attachment includes one or more adhesive films capable of semiconductor die attachment, and one or more conductive elements embedded in the one or more adhesive films.