公开(公告)号：US08357266B2

公开(公告)日：2013-01-22

申请号：US12212506

申请日：2008-09-17

申请人： Milan Ilic ,  Robert B. Huff ,  George W. McDonough

发明人： Milan Ilic ,  Robert B. Huff ,  George W. McDonough

IPC分类号： C23C14/34

CPC分类号： C23C14/34 ,  C23C14/54 ,  H01J37/32935 ,  H01J37/3299

摘要： A method and system for conditioning a vapor deposition target is described. In one illustrative embodiment, a vapor deposition system is operated in which a vapor deposition target is used, the occurrence of electrical arcs in the vapor deposition system is detected, and the vapor deposition target is conditioned by adjusting an output current of a power supply that powers the vapor deposition system and adjusting an interval during which energy is delivered to each arc to deliver substantially the same energy to each arc. In some embodiments, the energy delivered to each arc is approximately equal to the maximum energy that the vapor deposition target can withstand without being damaged. The described method and system significantly reduces the time required to remove impurities from a target and does not require the venting of the vacuum chamber or the removal of the target from the chamber.

摘要翻译： 描述了用于调节气相沉积靶的方法和系统。 在一个示例性实施例中，操作气相沉积系统，其中使用气相沉积靶，在气相沉积系统中发现电弧，并且通过调节电源的输出电流来调节气相沉积靶， 为蒸镀系统提供动力并调整能量传送到每个电弧的时间间隔，以向每个电弧输送基本相同的能量。 在一些实施例中，输送到每个电弧的能量近似等于气相沉积靶能够承受而不被损坏的最大能量。 所描述的方法和系统显着地减少了从靶中除去杂质所需的时间，并且不需要真空室的排放或者从室中移出靶。

公开(公告)号：US07445695B2

公开(公告)日：2008-11-04

申请号：US11413434

申请日：2006-04-28

申请人： Milan Ilic ,  Robert B. Huff ,  George W. McDonough

发明人： Milan Ilic ,  Robert B. Huff ,  George W. McDonough

IPC分类号： C23C14/34

CPC分类号： C23C14/34 ,  C23C14/54 ,  H01J37/32935 ,  H01J37/3299

摘要： A method and system for conditioning a vapor deposition target is described. In one illustrative embodiment, a vapor deposition system is operated in which a vapor deposition target is used, the occurrence of electrical arcs in the vapor deposition system is detected, and the vapor deposition target is conditioned by adjusting an output current of a power supply that powers the vapor deposition system and adjusting an interval during which energy is delivered to each arc to deliver substantially the same energy to each arc. In some embodiments, the energy delivered to each arc is approximately equal to the maximum energy that the vapor deposition target can withstand without being damaged. The described method and system significantly reduces the time required to remove impurities from a target and does not require the venting of the vacuum chamber or the removal of the target from the chamber.

摘要翻译： 描述了用于调节气相沉积靶的方法和系统。 在一个说明性实施例中，操作气相沉积系统，其中使用气相沉积靶，在气相沉积系统中发现电弧，并且通过调节电源的输出电流来调节气相沉积靶， 为蒸镀系统提供动力并调整能量传送到每个电弧的时间间隔，以向每个电弧输送基本相同的能量。 在一些实施例中，输送到每个电弧的能量近似等于气相沉积靶材能够承受而不被损坏的最大能量。 所描述的方法和系统显着地减少了从靶中除去杂质所需的时间，并且不需要真空室的排放或者从室中移出靶。

公开(公告)号：US20090008240A1

公开(公告)日：2009-01-08

申请号：US12212506

申请日：2008-09-17

申请人： Milan Ilic ,  Robert B. Huff ,  George W. McDonough

发明人： Milan Ilic ,  Robert B. Huff ,  George W. McDonough

IPC分类号： C23C14/00

CPC分类号： C23C14/34 ,  C23C14/54 ,  H01J37/32935 ,  H01J37/3299

摘要： A method and system for conditioning a vapor deposition target is described. In one illustrative embodiment, a vapor deposition system is operated in which a vapor deposition target is used, the occurrence of electrical arcs in the vapor deposition system is detected, and the vapor deposition target is conditioned by adjusting an output current of a power supply that powers the vapor deposition system and adjusting an interval during which energy is delivered to each arc to deliver substantially the same energy to each arc. In some embodiments, the energy delivered to each arc is approximately equal to the maximum energy that the vapor deposition target can withstand without being damaged. The described method and system significantly reduces the time required to remove impurities from a target and does not require the venting of the vacuum chamber or the removal of the target from the chamber.

摘要翻译： 描述了用于调节气相沉积靶的方法和系统。 在一个示例性实施例中，操作气相沉积系统，其中使用气相沉积靶，在气相沉积系统中发现电弧，并且通过调节电源的输出电流来调节气相沉积靶， 为蒸镀系统提供动力并调整能量传送到每个电弧的时间间隔，以向每个电弧输送基本相同的能量。 在一些实施例中，输送到每个电弧的能量近似等于气相沉积靶材能够承受而不被损坏的最大能量。 所描述的方法和系统显着地减少了从靶中除去杂质所需的时间，并且不需要真空室的排放或者从室中移出靶。