公开(公告)号：US20190024252A1

公开(公告)日：2019-01-24

申请号：US15970271

申请日：2018-05-03

Applicant: Ming Chi University of Technology

Inventor： Kun-Cheng Peng ,  Min-Zen Lee ,  Yao-Tien Tseng ,  Chun-Ying Lee ,  Po-Yan Su

IPC: C25D3/18 ,  C25D3/22 ,  C25D3/46 ,  C25D3/48 ,  C25D3/38

Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.