公开(公告)号：US11667540B2

公开(公告)日：2023-06-06

申请号：US17535596

申请日：2021-11-25

Applicant: Ming Chi University of Technology

Inventor： Kun-Cheng Peng ,  Chun-Ying Lee ,  Kuan-Ting Wu ,  Chen-Wei Chu ,  Yan-Chen Lin

IPC: C01G23/053 ,  B01J21/06 ,  B05D1/02 ,  B01J37/02 ,  B01J35/00

CPC classification number: C01G23/0536 ,  B05D1/02 ,  B01J21/063 ,  B01J35/004 ,  B01J37/0215 ,  B05D2203/30 ,  C01P2002/52

Abstract: The manufacturing method of titanium dioxide solution includes: mixing choline chloride, urea, boric acid, and titanium tetrachloride to form a first solution, wherein a molar concentration ratio of choline chloride to urea is 1:2, a molar concentration of titanium tetrachloride is 0.2 M to 0.4 M, and weight/volume of boric acid is 5 g/300 ml to 15 g/300 ml; and heating the first solute ion to form a second solution, wherein the second solution contains carbon/nitrogen doped titanium dioxide. In the manufacturing method of the present disclosure, the deep eutectic solution formed by choline chloride and urea may be used as a solvent, and may also be used as a carbon source and/or a nitrogen source. Therefore, titanium dioxide may be doped with carbon and/or nitrogen during the formation process.

公开(公告)号：US20190024252A1

公开(公告)日：2019-01-24

申请号：US15970271

申请日：2018-05-03

Applicant: Ming Chi University of Technology

Inventor： Kun-Cheng Peng ,  Min-Zen Lee ,  Yao-Tien Tseng ,  Chun-Ying Lee ,  Po-Yan Su

IPC: C25D3/18 ,  C25D3/22 ,  C25D3/46 ,  C25D3/48 ,  C25D3/38

Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.

公开(公告)号：US11549189B1

公开(公告)日：2023-01-10

申请号：US17686433

申请日：2022-03-04

Applicant: Ming Chi University of Technology

Inventor： Kun-Cheng Peng ,  Wei-Chuan Shih ,  Cheng-Rong He ,  Ting-Han Chen ,  Dong-Qing Su ,  Jian-Rong Chen

IPC: C25D3/02 ,  C25D3/04 ,  C25D3/10 ,  C25D3/12 ,  C25D3/22 ,  C25D3/32 ,  C25D3/38 ,  C25D3/54 ,  C25D17/00 ,  C12N1/20

Abstract: The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.

公开(公告)号：US11359299B2

公开(公告)日：2022-06-14

申请号：US17477548

申请日：2021-09-17

Applicant: Ming Chi University of Technology

Inventor： Kun-Cheng Peng ,  Chi-Ting Chung ,  Chun-Ying Lee ,  Ruei-You Liou ,  Yi-Xian Li

IPC: C25D3/66 ,  C25D5/50 ,  C25D5/10 ,  C25D3/54 ,  C25D3/32

Abstract: The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.