公开(公告)号：US06834711B2

公开(公告)日：2004-12-28

申请号：US10425954

申请日：2003-04-30

申请人： Ming-Hwa Liu ,  Brian D. F. Chen ,  Cheng Paug Chang

发明人： Ming-Hwa Liu ,  Brian D. F. Chen ,  Cheng Paug Chang

IPC分类号： H05K720

CPC分类号： H01L23/367 ,  F28F3/02 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat-radiating structure with low height, including a first heat-radiating plate and a second heat-radiating plate spaced above the first heat-radiating plate. The first heat-radiating plate is formed with multiple first perforations arranged at intervals and multiple first dents arranged at intervals and extending downward. The second heat-radiating plate is formed with multiple second perforations arranged at intervals and multiple second dents extending downward and fitted with the first perforations. A heat-generating body such as a CPU is adjacent to outer sides of the bottoms of the first and second dents. The heat-radiating structure has a height much smaller than that of a conventional vertical heat-radiating plate and a heat conducting area much larger than that of the vertical heat-radiating plate. Accordingly, the heat-radiating structure can achieve better heat-radiating effect and is applicable to those products having small internal space and necessitating heat-radiation, such as a portable computer.

摘要翻译： 一种具有低高度的散热结构，包括在第一散热板上方间隔开的第一散热板和第二散热板。 第一散热板形成有间隔布置的多个第一穿孔和间隔布置并向下延伸的多个第一凹痕。 第二散热板形成有多个第二穿孔，间隔布置，多个第二凹口向下延伸并装配有第一穿孔。 诸如CPU的发热体邻近第一和第二凹陷的底部的外侧。 散热结构的高度比传统的垂直散热板的高度远远大于垂直散热板的导热面积。 因此，散热结构可以获得更好的散热效果，并且适用于具有小的内部空间并且需要热辐射的产品，例如便携式计算机。