公开(公告)号：US20100146778A1

公开(公告)日：2010-06-17

申请号：US12631966

申请日：2009-12-07

申请人： Minoru DOOKA ,  Kazunori KUNIMOTO ,  Katsunori OGATA ,  Naohiro YAMADA

发明人： Minoru DOOKA ,  Kazunori KUNIMOTO ,  Katsunori OGATA ,  Naohiro YAMADA

IPC分类号： H05K3/30

CPC分类号： H01G13/006 ,  H01G4/232 ,  H01G4/30 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T156/1092

摘要： A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

摘要翻译： 电子芯片部件的制造方法包括以下步骤：通过将糊剂涂布在电子部件主体的第一端面上形成第一糊剂层，第二端面粘贴在具有粘合剂表面的基板上，并干燥该糊料，转动 电子部件主体180度，以便在滑动件与电子部件主体的第一端面接触的状态下，通过相对于基板滑动滑块来将电子部件主体的第一端面粘贴到基板上 通过将糊剂涂覆到电子部件主体的第二端面上并干燥该糊料，并焙烧第一和第二糊料层，形成第二糊剂层。

公开(公告)号：US20110088840A1

公开(公告)日：2011-04-21

申请号：US12980382

申请日：2010-12-29

申请人： Minoru DOOKA ,  Kazunori KUNIMOTO ,  Katsunori OGATA ,  Naohiro YAMADA

发明人： Minoru DOOKA ,  Kazunori KUNIMOTO ,  Katsunori OGATA ,  Naohiro YAMADA

IPC分类号： B32B37/00

CPC分类号： H01G13/006 ,  H01G4/232 ,  H01G4/30 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T156/1092

摘要： A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.

摘要翻译： 电子芯片部件的制造方法包括以下步骤：通过将糊剂涂布在电子部件主体的第一端面上形成第一糊剂层，第二端面粘贴在具有粘合剂表面的基板上，并干燥该糊料，转动 电子部件主体180度，以便在滑动件与电子部件主体的第一端面接触的状态下，通过相对于基板滑动滑块来将电子部件主体的第一端面粘贴到基板上 通过将糊剂涂覆到电子部件主体的第二端面上并干燥该糊料，并焙烧第一和第二糊料层，形成第二糊剂层。

公开(公告)号：US20080131589A1

公开(公告)日：2008-06-05

申请号：US11946526

申请日：2007-11-28

申请人： Katsunori OGATA ,  Kenichi AOKI

发明人： Katsunori OGATA ,  Kenichi AOKI

IPC分类号： B05D5/12 ,  B05C3/02

CPC分类号： H01G4/005 ,  H01C1/14 ,  H01C1/144 ,  H01C17/281 ,  H01G4/228 ,  H01G9/008 ,  H01G13/006

摘要： To provide a method for forming an outer electrode capable of reducing a tact time when electrode paste is applied to end surfaces of electronic components a plurality of times. A paste tank 4 having a squeegee blade that is vertically slidable is disposed on a flat board 1 having an area being a plurality of times as large as that of a holding plate in a longitudinal direction of the flat board. A paste film is spread on the flat board by moving the flat board 1 by a length corresponding to the length of one holding plate while a predetermined gap is maintained between the squeegee blade and the flat board. The electrode paste is applied to first end surfaces of electronic components C held by the holding plate H by dipping the first end surfaces of the electronic components C in this paste film. The electrode paste is applied to the first end surfaces of the electronic components a plurality of times by repeating the spreading step and the applying step.

摘要翻译： 提供一种形成外部电极的方法，其能够在将电极糊剂多次施加到电子部件的端面时减少跳动时间。 具有可垂直滑动的刮板的糊料罐4设置在平板1上，该平板1的平面板的长度方向的面积为保持板的面积的多倍。 通过使平板1移动与一个保持板的长度相对应的长度，同时在刮板和平板之间保持预定的间隙，将糊状物膜分散在平板上。 通过将电子部件C的第一端面浸渍在该糊状膜中，将电极浆料涂敷到由保持板H保持的电子部件C的第一端面。 通过重复扩展步骤和施加步骤，将电极浆料多次施加到电子部件的第一端面。

公开(公告)号：US20120171001A1

公开(公告)日：2012-07-05

申请号：US13338339

申请日：2011-12-28

申请人： Katsunori OGATA ,  Miyuki MIZUKAMI

发明人： Katsunori OGATA ,  Miyuki MIZUKAMI

IPC分类号： H05K3/00

CPC分类号： H01G13/006 ,  H01G4/232 ,  H01G4/30 ,  H01G13/00 ,  Y10T29/43 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.

摘要翻译： 电子部件制造方法包括以下步骤：准备至少一个具有相对的第一表面和第二表面的电子部件芯片; 将所述电子部件芯片保持在第一板和第二板之间，使得所述第一表面与所述第一板的第一弹性层接触，并且所述第二表面与所述第二板的第二弹性层接触; 并且通过使用平面移动机构在平面方向上使第一和第二板相对移动来转动电子部件芯片，并且使用平面移动机构根据电子部件芯片的转动路径移动第一和第二板，并且垂直 运动机制。