摘要:
Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要:
Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.
摘要:
Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要:
Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.
摘要:
A review SEM is provided with a means to store sets of images acquired using multiple imaging conditions or sets of images for which multiple imaging conditions are simulated using simulation, a means to store defect position information for each set of images, and a means to store information relating to imaging conditions and process time. A means to estimate predicted capture rate and throughput with the individual imaging conditions for the sets of images from the stored information, and a means to display the results thereof are additionally provided.
摘要:
Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要:
Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要:
It is intended to reduce the auto focusing time and to increase the stability in a case that a defect on a specimen that has been detected by an inspection apparatus is observed by using a scanning electron microscope. One or more regions to be used for auto focusing are set in an imaging region or its neighborhood on the basis of semiconductor design information. A target focusing position in the imaging region is determined by performing auto focusing using the thus-set regions. The determined target focusing position is used for low-magnification imaging and high-magnification imaging. An auto focusing mode that is suitable for each imaging region is selected on the basis of the semiconductor design information.
摘要:
A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.
摘要:
A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit.