Heat Coupling Device
    1.
    发明申请
    Heat Coupling Device 审中-公开
    热耦合装置

    公开(公告)号:US20100031403A1

    公开(公告)日:2010-02-04

    申请号:US12376160

    申请日:2006-08-11

    IPC分类号: G01Q60/24

    摘要: The invention concerns a heat coupling device for scanning force or atomic force microscopy, comprising a first heat conducting device (27), a second heat conducting device (28) and a coupling device (36, 38, 39, 40, 41), in which the first heat conducting device (27) is movable relative to the second heat conducting device (28) and the coupling device (36, 38, 39, 40, 41) is arranged between the first and second heat conducting device (27, 28) and designed so that it is at least partially deformable fluid-like and/or flexible and the heat can be transferred between the first and second heat conducting device (28).

    摘要翻译: 本发明涉及一种用于扫描力或原子力显微镜的热耦合装置,包括第一导热装置(27),第二导热装置(28)和联接装置(36,38,39,40,41),其中 所述第一导热装置(27)相对于所述第二导热装置(28)可移动,并且所述联接装置(36,38,39,40,41)布置在所述第一和第二导热装置(27,28)之间 ),并且被设计成使得其至少部分可变形地流体状和/或柔性,并且热量可以在第一和第二导热装置(28)之间传递。