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公开(公告)号：US20240146018A1
公开(公告)日：2024-05-02
申请号：US18264590
申请日：2021-02-16
发明人： Nao HIROSHIGE
IPC分类号： H01S5/0232 , H01S5/0231 , H01S5/0237 , H01S5/024
CPC分类号： H01S5/0232 , H01S5/0231 , H01S5/0237 , H01S5/02469
摘要： An optical communication module of the present disclosure includes a plate-shaped stem, a plurality of leads penetrating through the stem via an insulating member, a conductive member for connection formed on either a top surface or a side surface of at least one lead among the plurality of leads, a heat sink block provided on the stem, a sub-mount which is fixed to the heat sink block and is provided with a metal pattern on a flat surface thereof, a semiconductor light emitting element which is fixed to the metal pattern and emits laser light, and a wire in which a metal ball formed at one end thereof is bonded to the metal pattern and the other end thereof is bonded to the at least one lead through bonding to the conductive member for connection.
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公开(公告)号：US20240006839A1
公开(公告)日：2024-01-04
申请号：US18255758
申请日：2021-01-28
发明人： Akio SHIRASAKI , Naoki KOSAKA , Masaaki SHIMADA , Tadayoshi HATA , Nao HIROSHIGE
IPC分类号： H01S5/02212 , H01S5/024
CPC分类号： H01S5/02212 , H01S5/02469
摘要： A semiconductor device according to the present disclosure includes a base body having a first face and a second face, a lead passing through a through hole penetrating the base body and extending to a side of the first face, a sealing body filling the through hole, a dielectric substrate having a first main surface and a second main surface erected with respect to the first face, a semiconductor laser provided on a side of the first main surface of the dielectric substrate, a signal line provided on the first main surface and electrically connected to the semiconductor laser, a connecting member electrically connecting the signal line and the lead to each other, and a rear surface conductor provided on the second main surface, wherein the sealing body is provided directly below the rear surface conductor as viewed from a direction perpendicular to the first face.
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