公开(公告)号：US11066731B2

公开(公告)日：2021-07-20

申请号：US16759926

申请日：2018-07-13

申请人： Mitsubishi Electric Corporation

发明人： Yasutomo Tanihara ,  Hiroyuki Chibahara ,  Taiki Donen ,  Satoshi Ochi ,  Takayuki Itotani

IPC分类号： H01H33/662 ,  H01H33/664 ,  C22C29/08

摘要： In an electric contact including a base material, high-melting-point substance particles, and an intermetallic compound, the intermetallic compound containing a MnX compound (X represents Te or Se) and a compound of a Mn—Cu solid-solution phase and X, is dispersed in the base material. If the Vickers hardness of the high-melting-point substance particles is higher than 0 Hv and lower than 200 Hv, the particle diameter of the high-melting-point substance particles is not smaller than 0.1 μm and not larger than 100 μm. If the Vickers hardness of the high-melting-point substance particles is 200 Hv or higher, the particle diameter is not smaller than 0.1 μm and not larger than 10 μm. The mass of X atoms is not lower than 1.5 mass % and not higher than 15 mass %. The atomic weight ratio Mn/(Mn+X) is not lower than 20 at % and not higher than 80 at %.