Thermal processing apparatus and thermal processing method

    公开(公告)号:US07038173B2

    公开(公告)日:2006-05-02

    申请号:US10357524

    申请日:2003-02-03

    IPC分类号: F27B5/14

    CPC分类号: H01L21/67115 C30B31/12

    摘要: A thermal processing apparatus, performing processing accompanied with heating on a substrate, having an upper lamp group directed toward a prescribed direction and a lower lamp group perpendicularly intersecting with the upper lamp group is provided with a lower reflector between the upper and lower lamp groups. The lower reflector is so provided as to reflect light from lamps, included in the lower lamp group, present on both end regions in relation to the direction of arrangement. Thus, the thermal processing apparatus can efficiently irradiate an auxiliary ring with reflected light from the lower lamp group and improve temperature uniformity when heating the substrate.