公开(公告)号：US20110124269A1

公开(公告)日：2011-05-26

申请号：US13005684

申请日：2011-01-13

申请人： Mitsuo TADA ,  Taro Takahashi

发明人： Mitsuo TADA ,  Taro Takahashi

IPC分类号： B24B51/00 ,  G01R33/12

CPC分类号： B24B37/013 ,  B24B49/105

摘要： An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.

摘要翻译： 涡电流传感器用于检测在诸如半导体晶片的基板的表面上形成的金属膜（或导电膜）。 涡流传感器包括设置在形成在基板上的金属膜或导电膜附近的传感器线圈，并且传感器线圈包括可操作以检测在金属膜或导电膜中产生的涡流的检测线圈。 检测线圈包括通过以单行和多层缠绕线形成的线圈，该行被定义为垂直于衬底的方向，并且该层被定义为平行于衬底的方向。

公开(公告)号：US20120088438A1

公开(公告)日：2012-04-12

申请号：US13313407

申请日：2011-12-07

申请人： Mitsuo TADA ,  Taro Takahashi

发明人： Mitsuo TADA ,  Taro Takahashi

IPC分类号： B24B51/00 ,  G01N27/72

CPC分类号： B24B37/013 ,  B24B49/105

摘要： An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.

摘要翻译： 涡电流传感器用于检测在诸如半导体晶片的基板的表面上形成的金属膜（或导电膜）。 涡流传感器包括设置在形成在基板上的金属膜或导电膜附近的传感器线圈，并且传感器线圈包括可操作以检测在金属膜或导电膜中产生的涡流的检测线圈。 检测线圈包括通过以单行和多层缠绕线形成的线圈，该行被定义为垂直于衬底的方向，并且该层被定义为平行于衬底的方向。