公开(公告)号：US20150013468A1

公开(公告)日：2015-01-15

申请号：US14275128

申请日：2014-05-12

Applicant: Mnemonics, Inc.

Inventor： Fred Johnson

IPC: G01L1/10 ,  G01N3/08

CPC classification number: G01L1/10 ,  G01N3/08

Abstract: A strain sensor for determining a strain experienced by a body under test in response to forces exerted on the body-under-test. The strain sensor comprises an interface member mounted on a surface of the body-under-test and a SAW sensor mounted on a surface of the interface member. The strain in the body-under-test is translated to strain in the SAW sensor and determined by the SAW sensor. The strain in the SAW sensor is responsive to the strain in the body-under-test.

Abstract translation: 一种应变传感器，用于响应于施加在被测体上的力确定被测体受到的应变。 应变传感器包括安装在被测体内的表面上的接口部件和安装在接口部件的表面上的SAW传感器。 被测体内的应变被转换为SAW传感器中的应变，并由SAW传感器确定。 SAW传感器中的应变响应于被测体内的应变。

公开(公告)号：US09429486B2

公开(公告)日：2016-08-30

申请号：US14275128

申请日：2014-05-12

Applicant: Mnemonics, Inc.

Inventor： Fred Johnson

IPC: G01L1/10 ,  G01N3/08

CPC classification number: G01L1/10 ,  G01N3/08

Abstract: A strain sensor for determining a strain experienced by a body under test in response to forces exerted on the body-under-test. The strain sensor comprises an interface member mounted on a surface of the body-under-test and a SAW sensor mounted on a surface of the interface member. The strain in the body-under-test is translated to strain in the SAW sensor and determined by the SAW sensor. The strain in the SAW sensor is responsive to the strain in the body-under-test.

Abstract translation: 一种应变传感器，用于响应于施加在被测体上的力确定被测体受到的应变。 应变传感器包括安装在被测体内的表面上的接口部件和安装在接口部件的表面上的SAW传感器。 被测体内的应变被转换为SAW传感器中的应变，并由SAW传感器确定。 SAW传感器中的应变响应于被测体内的应变。

公开(公告)号：US09166553B2

公开(公告)日：2015-10-20

申请号：US14053580

申请日：2013-10-14

Applicant: Mnemonics, Inc.

Inventor： Fred Johnson ,  Madjid A Belkerdid ,  Michael Keefe

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H01L23/053 ,  H01L23/00

CPC classification number: H03H9/02992 ,  H01L23/053 ,  H01L23/562 ,  H01L2924/0002 ,  H03H9/02897 ,  H03H9/059 ,  H03H9/1078 ,  H01L2924/00

Abstract: A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.

Abstract translation: 用于封装SAW器件的表面声波（SAW）器件封装和方法提供了具有小占地面积，低成本并根据独特制造工艺制造的表面激励器件。 包括第一侧上的SAW有源区的衬底被结合到具有足以允许SAW在衬底的顶表面上传播的空间的另一相似尺寸的衬底。 两个基板具有相似的热膨胀系数，使得来自密封过程的应力最小化。 使用低熔点玻璃或有机化合物密封两个基板，使得通过密封件存在导电路径，允许内部装置进入外部电连接。

公开(公告)号：US20140103465A1

公开(公告)日：2014-04-17

申请号：US14053580

申请日：2013-10-14

Applicant: Mnemonics, Inc.

Inventor： Fred Johnson ,  Madjid A. Belkerdid ,  Michael Keefe

IPC: H03H9/02

CPC classification number: H03H9/02992 ,  H01L23/053 ,  H01L23/562 ,  H01L2924/0002 ,  H03H9/02897 ,  H03H9/059 ,  H03H9/1078 ,  H01L2924/00

Abstract: A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.

Abstract translation: 用于封装SAW器件的表面声波（SAW）器件封装和方法提供了具有小占地面积，低成本并根据独特制造工艺制造的表面激励器件。 包括第一侧上的SAW有源区的衬底被结合到具有足以允许SAW在衬底的顶表面上传播的空间的另一相似尺寸的衬底。 两个基板具有类似的热膨胀系数，使得来自密封过程的应力最小化。 使用低熔点玻璃或有机化合物密封两个基板，使得通过密封件存在导电路径，允许内部装置进入外部电连接。