公开(公告)号：US09166553B2

公开(公告)日：2015-10-20

申请号：US14053580

申请日：2013-10-14

Applicant: Mnemonics, Inc.

Inventor： Fred Johnson ,  Madjid A Belkerdid ,  Michael Keefe

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H01L23/053 ,  H01L23/00

CPC classification number: H03H9/02992 ,  H01L23/053 ,  H01L23/562 ,  H01L2924/0002 ,  H03H9/02897 ,  H03H9/059 ,  H03H9/1078 ,  H01L2924/00

Abstract: A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.

Abstract translation: 用于封装SAW器件的表面声波（SAW）器件封装和方法提供了具有小占地面积，低成本并根据独特制造工艺制造的表面激励器件。 包括第一侧上的SAW有源区的衬底被结合到具有足以允许SAW在衬底的顶表面上传播的空间的另一相似尺寸的衬底。 两个基板具有相似的热膨胀系数，使得来自密封过程的应力最小化。 使用低熔点玻璃或有机化合物密封两个基板，使得通过密封件存在导电路径，允许内部装置进入外部电连接。

公开(公告)号：US20140103465A1

公开(公告)日：2014-04-17

申请号：US14053580

申请日：2013-10-14

Applicant: Mnemonics, Inc.

Inventor： Fred Johnson ,  Madjid A. Belkerdid ,  Michael Keefe

IPC: H03H9/02

CPC classification number: H03H9/02992 ,  H01L23/053 ,  H01L23/562 ,  H01L2924/0002 ,  H03H9/02897 ,  H03H9/059 ,  H03H9/1078 ,  H01L2924/00

Abstract: A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.

Abstract translation: 用于封装SAW器件的表面声波（SAW）器件封装和方法提供了具有小占地面积，低成本并根据独特制造工艺制造的表面激励器件。 包括第一侧上的SAW有源区的衬底被结合到具有足以允许SAW在衬底的顶表面上传播的空间的另一相似尺寸的衬底。 两个基板具有类似的热膨胀系数，使得来自密封过程的应力最小化。 使用低熔点玻璃或有机化合物密封两个基板，使得通过密封件存在导电路径，允许内部装置进入外部电连接。