Apparatus for cleaning a wafer
    1.
    发明申请
    Apparatus for cleaning a wafer 审中-公开
    清洁晶片的装置

    公开(公告)号:US20070051393A1

    公开(公告)日:2007-03-08

    申请号:US11516101

    申请日:2006-09-06

    IPC分类号: B08B3/00 B08B3/04

    CPC分类号: B08B3/04 H01L21/67051

    摘要: An apparatus for cleaning a wafer includes a rotary chuck for supporting and rotating a wafer, a cleaning solution supply unit for supplying a cleaning solution onto the wafer, a bowl spaced apart from and surrounding the rotary chuck, and a protrusion portion protruded from the rotary chuck and having a slope face with respect to the rotary chuck. The protrusion portion can prevent an ascending air stream from being generated by a vortex when the rotary chuck rotates. A guide member can be positioned between the bowl and the rotary chuck to guide the cleaning solution downwardly to a bottom portion of the bowl. A protector can extend from an inner side surface of the guide member toward the rotary chuck, to prevent an ascending air stream caused by the vortex.

    摘要翻译: 一种用于清洗晶片的设备包括用于支撑和旋转晶片的旋转卡盘,用于将清洁溶液供应到晶片上的清洁溶液供应单元,与旋转卡盘间隔开并围绕旋转卡盘的碗,以及从旋转盘 并且相对于旋转卡盘具有倾斜面。 当旋转卡盘旋转时,突出部分可以防止上升的气流由涡流产生。 引导构件可以定位在碗和旋转卡盘之间,以将清洁溶液向下引导到碗的底部。 保护器可以从引导构件的内侧表面朝向旋转卡盘延伸,以防止由涡流引起的上升气流。

    Substrate transfer robot and apparatus having the substrate transfer robot for cleaning a substrate
    2.
    发明申请
    Substrate transfer robot and apparatus having the substrate transfer robot for cleaning a substrate 审中-公开
    具有用于清洗基板的基板传送机器人的基板传送机器人和设备

    公开(公告)号:US20070157957A1

    公开(公告)日:2007-07-12

    申请号:US11649485

    申请日:2007-01-04

    IPC分类号: B08B3/00 B65H1/00 C23F1/00

    摘要: In a substrate transfer robot and a substrate cleaning apparatus, the substrate transfer robot transfers substrates between a container supported by a load port and a processing module for cleaning the substrates. The substrate transfer robot includes a driving member that provides a driving force to transfer the substrates, a blade that transfers the substrates using the driving force, and a sensor that senses impurities existing on the blade. When the impurities are detected, a controller can control the operation of the driving member. Thus, the contamination of other substrates in the container can be effectively prevented.

    摘要翻译: 在基板传送机器人和基板清洁装置中,基板传送机器人在由负载端口支撑的容器和用于清洁基板的处理模块之间传送基板。 衬底传送机器人包括提供驱动力以传送衬底的驱动构件,使用驱动力传送衬底的刀片和感测存在于刀片上的杂质的传感器。 当检测到杂质时,控制器可以控制驱动构件的操作。 因此,能够有效地防止容器内的其他基板的污染。

    Cleaning solution spraying unit and wafer cleaning apparatus with the same
    3.
    发明申请
    Cleaning solution spraying unit and wafer cleaning apparatus with the same 审中-公开
    清洗液喷雾装置及晶圆清洗装置

    公开(公告)号:US20080041430A1

    公开(公告)日:2008-02-21

    申请号:US11894543

    申请日:2007-08-21

    IPC分类号: B08B3/02

    CPC分类号: B08B3/024 H01L21/67051

    摘要: There is provided a cleaning solution spraying unit. The cleaning solution spraying unit comprises a number of nozzles installed in a nozzle base, along a top surface of a wafer, and radially spraying a cleaning solution on the wafer, wherein the nozzle base is positioned above the wafer; and a power unit rotating the nozzles at a predetermined angle relative to a line extending perpendicularly from the top surface of the wafer. In addition, provided is a wafer cleaning apparatus including the cleaning solution spraying unit with the above-described constitution.

    摘要翻译: 提供了清洗溶液喷涂单元。 清洗溶液喷涂单元包括沿着晶片顶表面安装在喷嘴基座中的多个喷嘴,并且在晶片上径向喷射清洁溶液,其中喷嘴基座位于晶片上方; 以及功率单元,其相对于从晶片的顶表面垂直延伸的线以预定角度旋转喷嘴。 此外,提供了一种包括具有上述结构的清洁溶液喷射单元的晶片清洁设备。