公开(公告)号：US20140120293A1

公开(公告)日：2014-05-01

申请号：US13993336

申请日：2011-12-22

申请人： Mohit Gupta ,  Haiwei Lu ,  Dingying D. Xu ,  Ninad Patel ,  Kowtilya Bijjula ,  P. Erasenthiran Poonjolai

发明人： Mohit Gupta ,  Haiwei Lu ,  Dingying D. Xu ,  Ninad Patel ,  Kowtilya Bijjula ,  P. Erasenthiran Poonjolai

IPC分类号： H01L21/683

CPC分类号： H01L21/6836 ,  C09J7/29 ,  C09J2203/326 ,  Y10T428/1471 ,  Y10T428/2848

摘要： The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be diced into individual microelectronic dice using an adhesive tape which reduces the potential of electrostatic discharge damage by the incorporation or anti-static, and may be compatible with a laser scribing process by the incorporation of ultraviolet light absorbing agents into an adhesive layer of the adhesive tape.

摘要翻译： 本公开涉及制造微电子器件的领域，其中诸如微电子晶片的微电子器件衬底可以使用粘合带切割成单独的微电子骰子，所述胶带通过引入或防静电来降低静电放电损伤的可能性 ，并且可以通过将紫外光吸收剂并入胶带的粘合剂层中而与激光划线工艺相容。