公开(公告)号：US20220115764A1

公开(公告)日：2022-04-14

申请号：US17558883

申请日：2021-12-22

申请人： Molex, LLC

发明人： Gary D. McCormack ,  Ian A. Kyles

IPC分类号： H01Q1/22 ,  H04B5/00 ,  H01Q5/25 ,  H01Q1/48 ,  H01Q1/52

摘要： A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.