公开(公告)号：US20130288535A1

公开(公告)日：2013-10-31

申请号：US13874033

申请日：2013-04-30

申请人： Molex Incorporated

发明人： In-Ho YOU ,  In-Chull YANG

IPC分类号： H01R24/62

CPC分类号： H01R24/62 ,  G06K7/0073 ,  H01R13/2442 ,  H01R27/02

摘要： The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is formed by a structure manufactured by molding the micro SIM card connecting terminal and the micro SD card connecting terminal by means of an integrated terminal mold, and then separating them by a cutting process.

摘要翻译： 本公开涉及通过集成终端模具模制微型SIM卡连接端子和微型SD卡连接端子，从而显着减少双存储卡插座的整个长度及其制造方法。 本发明由通过一体化终端模具成型微型SIM卡连接端子和微型SD卡连接端子而制造的结构形成，然后通过切割工艺分离。