公开(公告)号：US20190103687A1

公开(公告)日：2019-04-04

申请号：US15721358

申请日：2017-09-29

申请人： Intel Corporation

发明人： GREGORIO R. MURTAGIAN ,  ZHICHAO ZHANG

IPC分类号： H01R12/70 ,  H01R13/24 ,  H01R13/646 ,  H01R43/16

CPC分类号： H01R12/7076 ,  H01R13/2442 ,  H01R13/2485 ,  H01R13/646 ,  H01R13/6474 ,  H01R43/16

摘要： High-speed data transmissions through a CPU socket are facilitated with CPU socket contacts that have a CPU socket contact body that improves bandwidth throughput. The CPU socket contact body is partially suspended from a CPU socket contact and may include a cavity. The CPU socket contact body includes capacitive impedance that substantially cancels an inductive impedance of the CPU socket contact. Canceling the inductive impedance causes the CPU socket contact to operate like an impedance-matched coaxial transmission line, which enables better bandwidth throughput than a non-impedance matched transmission line.

公开(公告)号：US20190036263A1

公开(公告)日：2019-01-31

申请号：US16043612

申请日：2018-07-24

申请人： Molex, LLC

发明人： Hazelton P. Avery ,  Pu Xie ,  Philip J. Dambach ,  Li Zhuang

IPC分类号： H01R13/405 ,  H01R13/518 ,  H01R13/631 ,  H01R13/26 ,  H01R13/6581

CPC分类号： H01R13/405 ,  H01R12/7064 ,  H01R12/712 ,  H01R13/2442 ,  H01R13/26 ,  H01R13/518 ,  H01R13/631 ,  H01R13/6581 ,  H01R13/6587

摘要： A connector assembly is provided, which includes a cage that defines a port and a card slot positioned in the port. Also included is a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals. The terminals are arranged so that two rows of contacts are provided, one row on a first side and one row on a second side of the card slot. Each wafer of the plurality of wafers includes an insulative frame, each terminal includes a beam portion cantilevered from the insulative frame supporting that terminal, and the cantilevered beam portion of at least one terminal of the at least four terminals has a molded material thereon.

公开(公告)号：US20180366163A1

公开(公告)日：2018-12-20

申请号：US15627632

申请日：2017-06-20

申请人： Western Digital Technologies, Inc.

发明人： Darya Amin-Shahidi ,  Toshiki Hirano ,  Lidu Huang ,  Todd McNally ,  Jeff Wilke

IPC分类号： G11B33/12 ,  G11B33/08 ,  H01R25/16 ,  H01R33/88 ,  H01R12/70 ,  H01R12/77 ,  H01R12/61

CPC分类号： G11B33/122 ,  G06F1/187 ,  G11B33/08 ,  G11B33/126 ,  G11B33/128 ,  H01R12/613 ,  H01R12/7076 ,  H01R12/774 ,  H01R12/778 ,  H01R12/91 ,  H01R13/2442 ,  H01R25/16 ,  H01R33/88

摘要： Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, a flexible mount electrical connection comprises a mating connector configured to physically couple with a hard drive connector and a plurality of electrical pins having a connector portion positioned within the mating connector configured to electrically couple with hard drive connector pins positioned within the hard drive connector. Each electrical pin has an extended portion extending away from the mating connector. The extended portion has an attachment portion configured to electrically couple the respective electrical pin to a printed circuit board, and the extended portion has a shape formed therein configured to reduce transmission of vibrations in the connector portion along each axis of a three-dimensional space to the attachment portion.

公开(公告)号：US20180331442A1

公开(公告)日：2018-11-15

申请号：US15974856

申请日：2018-05-09

申请人： LOTES CO., LTD

发明人： Chang Wei Huang ,  Ted Ju ,  Zhi Yong Zhou ,  Yong Quan Wu ,  Zuo Feng Jin ,  Chien Chih Ho ,  Tung Ming Ho

IPC分类号： H01R12/58 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24

CPC分类号： H01R12/585 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2442

摘要： An electrical connector configured to electrically connect to a chip module includes: a body, provided with at least one accommodating hole, where the body has a protruding block provided to protrude upward from one side of the accommodating hole, and the protruding block is configured to support the chip module upward; and at least one terminal, correspondingly accommodated in the at least one accommodating hole. The terminal includes a base, accommodated in the accommodating hole; an elastic arm, formed by extending forward from the base, located at one side of the protruding block, and configured to be electrically connected with the chip module; and a through slot, running vertically through the elastic arm. The protruding block has a rear end. The base is located behind the rear end, and the through slot extends forward beyond the rear end.

公开(公告)号：US20180323560A1

公开(公告)日：2018-11-08

申请号：US15587731

申请日：2017-05-05

申请人： Eaton Corporation

发明人： Michael Anthony Wynnik ,  Gordon Stanley Pettersen ,  John Michael Kokenda

IPC分类号： H01R25/14 ,  H01R13/22 ,  H01R13/24 ,  H01R13/58

CPC分类号： H01R25/142 ,  H01R13/22 ,  H01R13/2442 ,  H01R13/5825

摘要： A plug-in device for use with a busway system comprising a busway housing defining a longitudinal axis includes a stab base housing having first and second opposite sides, one or more stab conductors extending out of and away from the stab base housing at each of the first and second sides of the stab base housing, and a ground conductor at an upper portion of the stab base housing. The stab base housing is configured to be received through an opening at a bottom portion of the busway housing and positioned in a first position and then rotated from the first position to a second position. The ground conductor is configured to contact a top wall of the busway housing in each of the first and second positions.

公开(公告)号：US20180316115A1

公开(公告)日：2018-11-01

申请号：US15770784

申请日：2016-10-11

申请人： AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Akio Kimura ,  Seido Nishijima

IPC分类号： H01R13/40 ,  H01R13/24

CPC分类号： H01R13/40 ,  H01R13/2421 ,  H01R13/2442 ,  H01R13/422 ,  H01R13/533

摘要： A connector (1) includes a terminal (10) and a housing (H) for accommodating the terminal. The terminal (10) includes a case (20) having a ceiling wall (21) and accommodated in the housing, a coil spring (30) accommodated inside the case while being compressed in a compression direction toward the ceiling wall of the case, and a first conductive member (40) having a contact portion (43) with a mating terminal and sandwiched between one end (31) of the coil spring and an inner wall of the case, the contact portion being movable in the compression direction to further compress the coil spring. The case (20) is made of a metal material.

公开(公告)号：US20180287269A1

公开(公告)日：2018-10-04

申请号：US15869532

申请日：2018-01-12

申请人： LOTES CO., LTD

发明人： Ted Ju

IPC分类号： H01R4/02 ,  H01R43/02 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K3/34 ,  H01R12/57

CPC分类号： H01R4/027 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H01R12/716 ,  H01R13/2407 ,  H01R13/2442 ,  H01R43/02 ,  H01R43/0221 ,  H01R43/16 ,  H05K3/3436 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2203/041

摘要： An electrical connector for electrically connecting a chip module to a circuit board, includes an insulation body having multiple receiving holes vertically running through the insulation body, multiple terminals respectively accommodated in the receiving holes, and multiple metal members not in contact with the chip module. Each metal member and the corresponding terminal are accommodated in a same receiving hole. Each metal member and the corresponding terminal clamp and fix a solder ball together, so that the solder ball is stably fixed by the terminal, thereby greatly reducing gaps between terminals on a strip, so that the terminals do not need to be designed by skipping gaps. When the terminals are assembled into a same row of receiving holes, the insertion of the terminals into the same row of receiving holes may be completed in one time.

公开(公告)号：US20180269609A1

公开(公告)日：2018-09-20

申请号：US15985522

申请日：2018-05-21

申请人： Arista Networks, Inc.

发明人： Duong Lu ,  Robert Wilcox ,  Richard Hibbs ,  Ian Fry ,  Arul Ramalingam ,  Jim Weaver ,  Tiffany Doria

IPC分类号： H01R12/71 ,  H01R13/631 ,  H01R12/91

CPC分类号： H01R12/716 ,  H01R12/722 ,  H01R12/91 ,  H01R13/2442 ,  H01R13/631 ,  H01R13/6315 ,  H05K7/1438 ,  H05K7/1454

摘要： A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

公开(公告)号：US10079443B2

公开(公告)日：2018-09-18

申请号：US15183973

申请日：2016-06-16

申请人： TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS JAPAN G.K.

发明人： Brian Patrick Costello ,  Naoki Hashimoto

IPC分类号： H01R13/24 ,  H01R12/58

CPC分类号： H01R13/2442 ,  H01R12/585 ,  H01R2201/20

摘要： Interposer socket includes a base substrate and a plurality of spring contacts coupled to the base substrate. Each of the spring contacts has an inclined section that extends away from a top side of the base substrate at a generally non-orthogonal orientation. The inclined section configured to be deflected toward the top side when an electronic module is mounted onto the interposer socket. The inclined section has a mating surface of the spring contact that is configured to engage the electronic module. The inclined section also includes first and second beam segments and a contact slot therebetween. The first and second beam segments extend in an oblique direction away from the top side. The contact slot has a slot width that is defined between inner edges of the first and second beam segments. The slot width increases as the contact slot extends in the oblique direction.

公开(公告)号：US20180261938A1

公开(公告)日：2018-09-13

申请号：US15761863

申请日：2015-09-28

申请人： RADIALL ,  SHANGHAI RADIALL ELECTRONICS CO., LTD.

发明人： Laurent PETIT ,  Shan QIN ,  Gong CHEN

IPC分类号： H01R12/71 ,  H01R13/41 ,  H01R13/24 ,  H01R13/6581 ,  H01R13/514

CPC分类号： H01R12/714 ,  H01R12/7082 ,  H01R12/73 ,  H01R12/91 ,  H01R13/2442 ,  H01R13/2478 ,  H01R13/41 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6581 ,  H01R13/6582 ,  H01R13/6594

摘要： The present invention relates to a unitary RF connector (1), intended in particular to link two printed circuit boards (PCB1, PCB2), comprising: —a central rigid RF line (A) comprising a conductive element (30, 40, 50) retained within an electrical insulating body (2) which is rigid; —at least one flexible RF line (B1, B2) comprising a conductive element (31, 32; 41, 42; 51, 52) linked to the conductive element (30, 40, 50) of the central rigid line (A) and being able to flex toward one of the end face (21, 22) of the insulating body taking any closer position when acted upon by the pressure force of a complementary connection element (PCB1, PCB2).