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    Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof
    1.
    发明授权
    Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof 有权
    化学机械抛光装置，垫调节器组件及抛光垫调理方法

    公开(公告)号：US07559824B2

    公开(公告)日：2009-07-14

    申请号：US11494613

    申请日：2006-07-28

    申请人： Moo-yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

    发明人： Moo-yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B24B1/04

    摘要： Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.

    摘要翻译： 提供化学机械抛光（CMP）装置，垫调节器组件和抛光垫调节方法。 CMP装置通过将具有安装在载体的下表面上的晶片的载体旋转在旋转的抛光台上，同时将浆料提供到附接到旋转的抛光台的上表面的抛光垫上来平坦化晶片。 CMP装置可以包括垫调节器组件，其通过将抛光垫调节液提供到抛光垫上来调节抛光垫，同时将兆声波振动传送到衬垫调节液以从抛光垫的表面去除异物。

    Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof
    2.
    发明申请
    Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof 有权
    化学机械抛光装置，垫调节器组件及抛光垫调理方法

    公开(公告)号：US20070077871A1

    公开(公告)日：2007-04-05

    申请号：US11494613

    申请日：2006-07-28

    申请人： Moo-Yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

    发明人： Moo-Yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

    IPC分类号： B24B1/00 ,  B24B29/00 ,  B24B21/18

    CPC分类号： B24B53/017 ,  B24B1/04

    摘要： Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.

    摘要翻译： 提供化学机械抛光（CMP）装置，垫调节器组件和抛光垫调节方法。 CMP装置通过将具有安装在载体的下表面上的晶片的载体旋转在旋转的抛光台上，同时将浆料提供到附接到旋转的抛光台的上表面的抛光垫上来平坦化晶片。 CMP装置可以包括垫调节器组件，其通过将抛光垫调节液提供到抛光垫上来调节抛光垫，同时将兆声波振动传送到衬垫调节液以从抛光垫的表面去除异物。