公开(公告)号：US20240308015A1

公开(公告)日：2024-09-19

申请号：US18185867

申请日：2023-03-17

Applicant: Raytheon Technologies Corporation

Inventor： Zhigang Wang ,  Andrzej E. Kuczek ,  Robin H. Fernandez ,  John D. Riehl ,  Alan C. Barron ,  Ahmed Abdillahi Abdi ,  Jason Nelson ,  Andrew Joseph Lazur

IPC: B24B1/04 ,  B24B57/02 ,  B25J9/00 ,  B25J9/02 ,  B25J9/16 ,  B25J11/00

CPC classification number: B24B1/04 ,  B24B57/02 ,  B25J9/0084 ,  B25J9/0096 ,  B25J9/026 ,  B25J9/161 ,  B25J11/0065

Abstract: An ultrasonic impact grinding assembly includes a base with a mount for connecting a workpiece to the base and a first tool arm. The ultrasonic impact grinding assembly also includes a second tool arm. The first tool arm and the second tool arm each include a base end, a distal end, at least one joint between the base end and the distal end, and at least one actuator configured to move the at least one joint. A first ultrasonic impact grinding tool head is connected to the distal end of the first tool arm. A second ultrasonic impact grinding tool head is connected to the distal end of the second tool arm.

公开(公告)号：US20240165764A1

公开(公告)日：2024-05-23

申请号：US17993342

申请日：2022-11-23

Applicant: Raytheon Technologies Corporation

Inventor： Zhigang Wang ,  Andrzej E. Kuczek ,  Robin H. Fernandez ,  John D. Riehl ,  Alan C. Barron ,  John Henry Shaw ,  Evan B. Callaway ,  Cheng Gao

IPC: B24B1/04 ,  B24B41/06 ,  B24B49/12 ,  B24B49/16

CPC classification number: B24B1/04 ,  B24B41/06 ,  B24B49/12 ,  B24B49/16

Abstract: A method of machining ceramic matrix composite components includes providing an ultrasonic vibration tool having a tool tip, and exciting the tool by providing a control current, such that the tool tip is repeatedly vibrated towards and away from a ceramic matrix composite workpiece. A slurry feed is supplied including abrasive particles to a surface to be machined by the tool tip. A vibration amplitude of the tool tip is controlled by sensing load on the tool and communicating with a computing device. The computing device controls the vibration amplitude of the tool tip. The computing device is provided with at least one memory programmed with historic data, and is operable to modify the vibration amplitude signal being sent to the tool, and comparing resulting load levels due to the change in vibration amplitude signals, and storing the change in vibration amplitude signals at the memory.

公开(公告)号：US11890724B2

公开(公告)日：2024-02-06

申请号：US16677883

申请日：2019-11-08

Applicant: Sander Hendrikus Johannes Hofstee ,  Jan Frederik Doddema

Inventor： Sander Hendrikus Johannes Hofstee ,  Jan Frederik Doddema

IPC: A46B13/02 ,  B24D13/02 ,  B24B29/00 ,  B24B1/04 ,  A46B13/00

CPC classification number: B24D13/02 ,  A46B13/005 ,  B24B1/04 ,  B24B29/00 ,  B24B29/005 ,  A46B13/001 ,  A46B2200/3093

Abstract: A surface of a workpiece is treated by rotating about an axis a brush having a multiplicity of radially projecting bristles with tips engaging a surface of a workpiece to be treated while positioning a stop nonrotatable with the brush in engagement with the bristles radially inward of the stop so as to rearwardly deflect the bristles prior to contact with the workpiece and thereby store kinetic energy in the bristles so that as the bristles pass the stop the kinetic energy is released and the bristles spring elastically forward and percussively strike the workpiece surface. A roughness of the workpiece surface is determined and the stop is positioned radially relative to the axis or the brush is positioned relative to the workpiece at a spacing in accordance with the determined roughness.

公开(公告)号：US20180036807A1

公开(公告)日：2018-02-08

申请号：US15671673

申请日：2017-08-08

Applicant: SAUER GmbH

Inventor： Jens KETELAER

IPC: B23B29/12

CPC classification number: B23B29/125 ,  B23C3/00 ,  B23C2220/48 ,  B23C2270/10 ,  B23Q15/013 ,  B24B1/04 ,  G05B19/4166 ,  H03K5/01

Abstract: A method and a device applying surface structuring to a surface of a workpiece on a machine tool, performing a feed motion of a milling cutter which is rotationally driven by a work spindle of the machine tool, received in a tool head of the machine tool and has at least one protruding cutting edge along the surface of the workpiece; applying the surface structuring in accordance with a predetermined pattern to the surface of the workpiece during the feed motion of the milling cutter on the basis of a control signal to an actuator which is integrated in the tool head and is configured to drive a vibration of the milling cutter on the basis of the control signal, wherein the control signal contains high-frequency carrier signal and a useful signal which modulates the carrier signal and which is generated on the basis of data indicating the predetermined pattern.

公开(公告)号：US09839983B2

公开(公告)日：2017-12-12

申请号：US14934433

申请日：2015-11-06

Applicant: Tongtai Machine & Tool Co., Ltd.

Inventor： Hsin-Pao Chen ,  Chung-Kuang Lin ,  Jian-Tzung Ou ,  Jui-Hsiung Yen

IPC: B24B1/00 ,  B24B1/04 ,  B24B49/14 ,  B24B51/00 ,  B24B49/10 ,  B23B37/00 ,  B23Q1/00 ,  B23Q1/48 ,  B23Q5/10 ,  B06B3/00 ,  B23B31/02

CPC classification number: B24B1/04 ,  B06B3/00 ,  B23B31/02 ,  B23B37/00 ,  B23B2260/108 ,  B23Q1/0009 ,  B23Q1/4828 ,  B23Q5/10 ,  B23Q2230/004 ,  B24B49/10 ,  B24B49/14 ,  B24B51/00

Abstract: A machine tool of high-frequency vibration is provided. A main shaft structure of the machine tool comprises a rotating shaft, the end of which is provided with a tool holder chuck for fixing a tool holder; the upper portion of which is provided with a rotating coil portion; the main shaft structure is correspondingly provided with a stationary coil portion; and the tool holder is provided with a high-frequency vibration module. By non-contact coils, an external electric power/signal can be transmitted into the high-frequency vibration module to avoid a wear phenomenon in a contact-rotating electrode. Because the inductive coil is arranged outside of the tool holder, the manufacturing cost of the tool holder is reduced, and the convenience of changing the tool holder is increased. Moreover, the machining stability and efficiency of the tool holder are improved by a control method of sensing/feedback signals with wireless transmission.

公开(公告)号：US09327377B2

公开(公告)日：2016-05-03

申请号：US13819744

申请日：2011-08-29

Applicant: Peter Keller-Sornig ,  Georg Hejtmann ,  Aldo Di Nicolantonio ,  Stefano Delfini ,  Ralf Materna ,  Adrian Schoch ,  Dieter Troendle

Inventor： Peter Keller-Sornig ,  Georg Hejtmann ,  Aldo Di Nicolantonio ,  Stefano Delfini ,  Ralf Materna ,  Adrian Schoch ,  Dieter Troendle

IPC: B24B1/04 ,  B24B21/22 ,  B24B23/06

CPC classification number: B24B1/04 ,  B24B21/22 ,  B24B23/06

Abstract: A machine tool, for example a hand-held belt grinder, is subjected to high frequencies outside a working plane between an abrasive belt and a workpiece. In particular, the machine tool is subject to high frequencies in a free-running region of the belt, of an excitation actuator, in particular by a piezo element.

Abstract translation: 机床，例如手持式带式磨床，在研磨带和工件之间的工作平面外受到高频率的影响。 特别地，机械工具在带的自由运行区域，激励致动器，特别是压电元件的自由运行区域中经受高频率。

公开(公告)号：US20150353412A1

公开(公告)日：2015-12-10

申请号：US14829089

申请日：2015-08-18

Applicant: CERON Technologies Inc.

Inventor： Hironori Minami

IPC: C03B33/037 ,  G05B13/02 ,  C03B33/10

CPC classification number: B24B1/04 ,  B24B7/248 ,  B24B9/10 ,  B24D7/18 ,  B28D1/041 ,  B28D1/14 ,  B28D5/021 ,  B28D5/047 ,  C03B33/037 ,  C03B33/10 ,  C03C17/00 ,  G05B13/0205 ,  G05B19/418 ,  G05B2219/45009 ,  Y10T409/303752 ,  Y10T409/304312

Abstract: To provide a method of processing a tempered glass in a simple and appropriate manner while a degree of freedom of processing is secured. Vibration of the processing device is controlled in a feedback fashion such that a vibration amplitude and a vibration frequency of the processing device approach to a target vibration amplitude and a target vibration frequency not to keep them in a range where a value of worsening the quality is generated. Further, a specified sample cycle of 0.3 msec or less in the feedback control is employed.

Abstract translation: 提供一种在确保加工自由度的同时以简单和适当的方式处理钢化玻璃的方法。 处理装置的振动以反馈方式进行控制，使得处理装置的振动振幅和振动频率接近目标振幅和目标振动频率，不会使其处于质量恶化值的范围内 生成。 此外，采用反馈控制中0.3msec以下的指定采样周期。

公开(公告)号：US09168625B2

公开(公告)日：2015-10-27

申请号：US13820975

申请日：2011-09-08

Applicant: Yumei Huang ,  Wen Yan ,  Feng Gao ,  Hao Jiang

Inventor： Yumei Huang ,  Wen Yan ,  Feng Gao ,  Hao Jiang

IPC: B24B1/04 ,  B24B37/08 ,  B24B7/17 ,  B24B41/06

CPC classification number: B24B1/04 ,  B24B7/17 ,  B24B37/08 ,  B24B41/067

Abstract: A computer numerical control machine tool for grinding two sides of a plane by shifting self-rotation ultrasonic vibration, wherein a pillar (3) is provided on the tool body (1) of the machine tool, a Y axis movement assembly (12) is provided on the platform of the tool body (1), with a lower revolving movement assembly (11), which revolves about a Z coordinate axis, being mounted on the upper surface of the Y axis movement assembly (12), and a lower grinding plate (10) being mounted coaxially above the lower revolving movement assembly (11); an ultrasonic vibration assembly (2) is mounted fixedly on the pillar (3), with a separation plate (8) for clamping a workpiece assembly (9) being provided on the ultrasonic vibration assembly (2); an X axis movement assembly (4) is mounted on the upper part of the pillar (3), a Z axis movement assembly (5) is mounted on the upright face of the X axis movement assembly (4), with an upper revolving movement assembly (6), which revolves about the Z coordinate axis, being provided on the Z axis movement assembly (5), and an upper grinding plate (7) being mounted coaxially on the revolving axis of the upper revolving movement assembly (6). The present invention enhances the time variation of grinding movement tracks, the uniformity of grinding speed distribution, machining efficiency and machining precision.

Abstract translation: 一种用于通过移动自旋超声波振动来研磨平面的两侧的计算机数字控制机床，其中在机床的工具主体（1）上设置有支柱（3），Y轴运动组件（12）是 设置在工具主体（1）的平台上，具有安装在Y轴运动组件（12）的上表面上的围绕Z坐标轴转动的下旋转运动组件（11），以及下磨 板（10）同轴地安装在下旋转运动组件（11）的上方; 超声波振动组件（2）固定地安装在支柱（3）上，具有用于夹紧设置在超声波振动组件（2）上的工件组件（9）的分隔板（8）。 X轴运动组件（4）安装在支柱（3）的上部，Z轴运动组件（5）安装在X轴运动组件（4）的直立面上，上运动组件 围绕Z坐标轴旋转的组件（6）设置在Z轴移动组件（5）上，以及同轴地安装在上部旋转运动组件（6）的旋转轴上的上部研磨板（7）。 本发明增加了研磨运动轨迹的时间变化，磨削速度分布的均匀性，加工效率和加工精度。

公开(公告)号：US20150231753A1

公开(公告)日：2015-08-20

申请号：US14421596

申请日：2013-07-31

Applicant: CERON Technologies Inc.

Inventor： Hironori Minami

IPC: B24B1/04 ,  B24D7/18 ,  C03B33/10

CPC classification number: B24B1/04 ,  B24B7/248 ,  B24B9/10 ,  B24D7/18 ,  B28D1/041 ,  B28D1/14 ,  B28D5/021 ,  B28D5/047 ,  C03B33/037 ,  C03B33/10 ,  C03C17/00 ,  G05B13/0205 ,  G05B19/418 ,  G05B2219/45009 ,  Y10T409/303752 ,  Y10T409/304312

Abstract: To provide a processing device for a tempered glass in which a period of employable time is significantly increased. The processing device (8) for processing a chemical tempered glass (1) having a surface reinforced layer, which is rotated around its shaft center and vibrated in a direction of extending the shaft center, is provided. At least an outer surface of a front end thereof is formed to be a surface (8b-1) for retaining diamond grind grains, and a concave portion (30) is formed on a central part in a radial direction on a front surface (8c) thereof.

Abstract translation: 提供一种钢化玻璃的加工装置，其中使用时间的时间显着增加。 提供了用于处理具有表面增强层的化学钢化玻璃（1）的处理装置（8），该表面增强层围绕其轴心旋转并沿着延伸轴心的方向振动。 其前端的至少外表面形成为用于保持金刚石研磨颗粒的表面（8b-1），并且在前表面（8c）上沿径向的中心部分形成凹部（30） ）。

公开(公告)号：US20150228511A1

公开(公告)日：2015-08-13

申请号：US14176545

申请日：2014-02-10

Applicant: Globalfoundries, Inc.

Inventor： Michael Wedlake

IPC: H01L21/67 ,  H01L21/306

CPC classification number: H01L21/30625 ,  B24B1/04 ,  B24B37/07

Abstract: Methods and a system for processing semiconductor substrates are provided. A method of processing a semiconductor substrate includes selecting a predetermined vibration profile that will achieve predetermined material removal characteristics from the semiconductor substrate in a chemical mechanical planarization (CMP) polish, actuating a vibration actuator based on the predetermined vibration profile, and polishing the semiconductor substrate based substantially entirely on the predetermined vibration profile achieved by actuation of the vibration actuator.

Abstract translation: 提供了用于处理半导体衬底的方法和系统。 一种处理半导体衬底的方法包括：在化学机械平面化（CMP）抛光中选择将从半导体衬底获得预定的材料去除特性的预定振动分布，基于预定的振动分布来致动振动致动器，以及研磨半导体衬底 基本上完全基于通过致动振动致动器实现的预定振动分布。